CPUs

HiSilicon Kirin 650 vs Qualcomm Snapdragon 653 Full Specs

8 Cores(4P+4E)
8 Threads(4P+4E)
2GHz
8 Cores(4P+4E)
8 Threads(4P+4E)
1.95GHz
TDP
5W
TDP
5W
Bandwidth
14.9GB/s
LPDDR3
Bandwidth
14.9GB/s
LPDDR3
iGPU
iGPU
··
36 GFLOPSFP32
··
307.2 GFLOPSFP16

8 Cores
4P
4E
8 Cores
4P
4E
8 Threads
4P
4E
8 Threads
4P
4E

Base Clock
2GHz
Base Clock
1.95GHz
Overclocking
Locked
Overclocking
Locked

L1i
16KB P
16KB E
L1i
32KB P
16KB E
L1d
16KB P
16KB E
L1d
32KB P
16KB E
L2
128KB E
1MB P shared
-
L2
1MB P shared
1MB E shared

Type
LPDDR3
Type
LPDDR3
Max Memory
-
Max Memory
8GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
64-bit
Bus Width
64-bit
Speed
1866MT/s
Speed
1866MT/s
Bandwidth
14.9GB/s
Bandwidth
14.9GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
14.9GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
14.9GB/s

TDP
5W
TDP
5W

iGPU
iGPU
Shaders
20
Shaders
128
Boost Clock
900MHz
Boost Clock
600MHz
··
36 GFLOPSFP32
··
307.2 GFLOPSFP16

NPU Model
-
NPU Model
Hexagon V56

Modem Model
Balong 720
Modem Model
X9
Peak Down
Up to 300Mbps
Peak Down
Up to 300Mbps
Peak Up
Up to 50Mbps
Peak Up
Up to 150Mbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Family
-
Family
Branding
Kirin  branding
Branding
Snapdragon  branding
Codename
Cortex-A53P-Core
Cortex-A53E-Core
Codename
Cortex-A72P-Core
Cortex-A53E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
May 1, 2016
Release Date
Oct 12, 2016

Foundry
Samsung
Foundry
Samsung
Fabrication Node
28nm LP
Fabrication Node
28nm LP