CPUs

HiSilicon Kirin 659 vs Qualcomm Snapdragon 636 Full Specs

8 Cores(4P+4E)
8 Threads(4P+4E)
2.36GHz
8 Cores(4P+4E)
8 Threads(4P+4E)
1.8GHz
TDP
5W
TDP
5W
Bandwidth
14.9GB/s
LPDDR3
Bandwidth
10.7GB/s
LPDDR4
iGPU
iGPU
··
36 GFLOPSFP32
··
368.6 GFLOPSFP16

8 Cores
4P
4E
8 Cores
4P
4E
8 Threads
4P
4E
8 Threads
4P
4E

Base Clock
2.36GHz
Base Clock
1.8GHz
Overclocking
Locked
Overclocking
Locked

L1i
16KB P
16KB E
L1i
32KB P
16KB E
L1d
16KB P
16KB E
L1d
32KB P
16KB E
L2
128KB E
1MB P shared
-
L2
2MB P shared
1MB E shared

Type
LPDDR3
Type
LPDDR4
Max Memory
-
Max Memory
8GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
64-bit
Bus Width
32-bit
Speed
1866MT/s
Speed
2666MT/s
Bandwidth
14.9GB/s
Bandwidth
10.7GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
14.9GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
10.7GB/s

TDP
5W
TDP
5W

iGPU
iGPU
Shaders
20
Shaders
128
Boost Clock
900MHz
Boost Clock
720MHz
··
36 GFLOPSFP32
··
368.6 GFLOPSFP16

NPU Model
-
NPU Model
Hexagon 680

Modem Model
Balong 720
Modem Model
X12
Peak Down
Up to 300Mbps
Peak Down
Up to 600Mbps
Peak Up
Up to 50Mbps
Peak Up
Up to 150Mbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Kryo 260ARMv8.0-A
Family
-
Family
Branding
Kirin  branding
Branding
Snapdragon  branding
Codename
Cortex-A53P-Core
Cortex-A53E-Core
Codename
Cortex-A73P-Core
Cortex-A53E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Aug 1, 2017
Release Date
Oct 17, 2017

Foundry
-
Foundry
Samsung
Fabrication Node
-
Fabrication Node
14LPP