HiSilicon Kirin 659 vs Qualcomm Snapdragon 845 Full Specs
8 Cores(4P+4E) 8 Threads(4P+4E) 2.36GHz | 8 Cores(4P+4E) 8 Threads(4P+4E) 2.8GHz |
TDP 5W | TDP 5W |
Bandwidth 14.9GB/s LPDDR3 | Bandwidth 29.9GB/s LPDDR4X |
iGPU | iGPU |
·· 36 GFLOPSFP32 | ·· 1.45 TFLOPSFP16 |
8 Cores 4P 4E | 8 Cores 4P 4E |
8 Threads 4P 4E | 8 Threads 4P 4E |
Base Clock 2.36GHz | Base Clock 2.8GHz |
Overclocking Locked | Overclocking Locked |
L1i 16KB P 16KB E | L1i 32KB P 32KB E |
L1d 16KB P 16KB E | L1d 32KB P 32KB E |
L2 - 128KB E 1MB P shared | L2 256KB P 128KB E - |
L3 - | L3 2MB |
SLC Cache - | SLC Cache 3MB |
Type LPDDR3 | Type LPDDR4X |
Max Memory - | Max Memory 16GB |
ECC No | ECC No |
Channels 2 | Channels 4 |
Bus Width 64-bit | Bus Width 64-bit |
Speed 1866MT/s | Speed 3733MT/s |
Bandwidth 14.9GB/s | Bandwidth 29.9GB/s |
Bandwidth Calculator Channels Transfer Rate ·· | Bandwidth Calculator Channels Transfer Rate ·· |
TDP 5W | TDP 5W |
iGPU | iGPU |
Shaders 20 | Shaders 512 |
Boost Clock 900MHz | Boost Clock 710MHz |
·· 36 GFLOPSFP32 | ·· 1.45 TFLOPSFP16 |
NPU Model - | NPU Model Hexagon 685 |
Performance - | Performance 3 TOPS |
Modem Model Balong 720 | Modem Model X20 |
Peak Down Up to 300Mbps | Peak Down Up to 1.2Gbps |
Peak Up Up to 50Mbps | Peak Up Up to 150Mbps |
Manufacturer | Manufacturer |
ISA AArch64 | ISA AArch64 |
Architecture | Architecture Kryo 385ARMv8.2-A |
Family - | Family |
Branding  | Branding  |
Codename Cortex-A53P-Core Cortex-A53E-Core | Codename Cortex-A75P-Core Cortex-A55E-Core |
Market Segment Smartphone | Market Segment Smartphone |
Release Date Aug 1, 2017 | Release Date Dec 6, 2017 |
Foundry - | Foundry Samsung |
Fabrication Node - | Fabrication Node 10LPP |
Smartphones - | Smartphones |
