CPUs

HiSilicon Kirin 810 vs Qualcomm Snapdragon 712 Full Specs

8 Cores(2P+6E)
8 Threads(2P+6E)
2.27GHz
8 Cores(2P+6E)
8 Threads(2P+6E)
2.3GHz
TDP
5W
TDP
5W
Bandwidth
34.1GB/s
LPDDR4X
Bandwidth
14.9GB/s
LPDDR4X
iGPU
iGPU
··
236.2 GFLOPSFP16
··
768 GFLOPSFP16

8 Cores
2P
6E
8 Cores
2P
6E
8 Threads
2P
6E
8 Threads
2P
6E

Base Clock
2.27GHz
Base Clock
2.3GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
32KB E
L1i
32KB P
32KB E
L1d
64KB P
32KB E
L1d
32KB P
32KB E
L2
512KB P
128KB E
L2
256KB P
128KB E
SLC Cache
-
SLC Cache
1MB

Type
LPDDR4X
Type
LPDDR4X
Max Memory
-
Max Memory
16GB
ECC
No
ECC
No
Channels
4
Channels
2
Bus Width
64-bit
Bus Width
32-bit
Speed
4266MT/s
Speed
3733MT/s
Bandwidth
34.1GB/s
Bandwidth
14.9GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
34.1GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
14.9GB/s

TDP
5W
TDP
5W

iGPU
iGPU
Shaders
72
Shaders
256
Boost Clock
820MHz
Boost Clock
750MHz
··
236.2 GFLOPSFP16
··
768 GFLOPSFP16

NPU Model
-
NPU Model
Hexagon 685
Performance
-
Performance
3 TOPS

Modem Model
Balong 750
Modem Model
X15
Peak Down
Up to 600Mbps
Peak Down
Up to 800Mbps
Peak Up
Up to 150Mbps
Peak Up
Up to 150Mbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Kryo 360ARMv8.2-A
Family
-
Family
Branding
Kirin  branding
Branding
Snapdragon  branding
Codename
Cortex-A76P-Core
Cortex-A55E-Core
Codename
Cortex-A75P-Core
Cortex-A55E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
May 1, 2019
Release Date
Oct 22, 2019

Foundry
-
Foundry
Samsung
Fabrication Node
-
Fabrication Node
10LPP