HiSilicon Kirin 810 vs Qualcomm Snapdragon 855 Full Specs
8 Cores(2P+6E) 8 Threads(2P+6E) 2.27GHz | 8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 2.84GHz |
TDP 5W | TDP 5W |
Bandwidth 34.1GB/s LPDDR4X | Bandwidth 34.1GB/s LPDDR4X |
iGPU | iGPU |
·· 236.2 GFLOPSFP16 | ·· 1.8 TFLOPSFP16 |
8 Cores 2P - 6E | 8 Cores 1P 3M 4E |
8 Threads 2P - 6E | 8 Threads 1P 3M 4E |
Base Clock 2.27GHz | Base Clock 2.84GHz |
Overclocking Locked | Overclocking Locked |
L1i 64KB P - 32KB E | L1i 64KB P 64KB M 32KB E |
L1d 64KB P - 32KB E | L1d 64KB P 64KB M 32KB E |
L2 512KB P - 128KB E | L2 512KB P 256KB M 128KB E |
L3 - | L3 2MB |
SLC Cache - | SLC Cache 3MB |
Type LPDDR4X | Type LPDDR4X |
Max Memory - | Max Memory 16GB |
ECC No | ECC No |
Channels 4 | Channels 4 |
Bus Width 64-bit | Bus Width 64-bit |
Speed 4266MT/s | Speed 4266MT/s |
Bandwidth 34.1GB/s | Bandwidth 34.1GB/s |
Bandwidth Calculator Channels Transfer Rate ·· | Bandwidth Calculator Channels Transfer Rate ·· |
TDP 5W | TDP 5W |
iGPU | iGPU |
Shaders 72 | Shaders 768 |
Boost Clock 820MHz | Boost Clock 585MHz |
·· 236.2 GFLOPSFP16 | ·· 1.8 TFLOPSFP16 |
NPU Model - | NPU Model Hexagon 690 |
NPU Clock - | NPU Clock 576MHz |
Performance - | Performance 7 TOPS |
Modem Model Balong 750 | Modem Model X24 |
Peak Down Up to 600Mbps | Peak Down Up to 2.0Gbps |
Peak Up Up to 150Mbps | Peak Up Up to 316Mbps |
Manufacturer | Manufacturer |
ISA AArch64 | ISA AArch64 |
Architecture | Architecture Kryo 485ARMv8.2-A |
Family - | Family |
Branding  | Branding  |
Codename - Cortex-A76P-Core - Cortex-A55E-Core | Codename Snapdragon 855Variant Cortex-A76P-Core Cortex-A76M-Core Cortex-A55E-Core |
Market Segment Smartphone | Market Segment Smartphone |
Release Date May 1, 2019 | Release Date Oct 22, 2019 |
Foundry - | Foundry TSMC |
Fabrication Node - | Fabrication Node N7 |
Die Size - | Die Size 77mm² |
Smartphones - | Smartphones |
