CPUs

HiSilicon Kirin 9000 4G vs Qualcomm Snapdragon 860 Full Specs

8 Cores(1P+3M+4E)
8 Threads(1P+3M+4E)
3.13GHz
8 Cores(1P+3M+4E)
8 Threads(1P+3M+4E)
2.96GHz
TDP
5W
TDP
5W
Bandwidth
44GB/s
·
Bandwidth
34.1GB/s
LPDDR4X
iGPU
iGPU
··
2.33 TFLOPSFP16
··
2.07 TFLOPSFP16

8 Cores
1P
3M
4E
8 Cores
1P
3M
4E
8 Threads
1P
3M
4E
8 Threads
1P
3M
4E

Base Clock
3.13GHz
Base Clock
2.96GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
64KB M
32KB E
L1i
64KB P
64KB M
32KB E
L1d
64KB P
64KB M
32KB E
L1d
64KB P
64KB M
32KB E
L2
512KB P
256KB M
128KB E
L2
512KB P
256KB M
128KB E
L3
8MB
L3
2MB
SLC Cache
-
SLC Cache
3MB

Type
·
Type
LPDDR4X
Max Memory
-
Max Memory
16GB
ECC
No
ECC
No
Channels
4
Channels
4
Bus Width
64-bit
Bus Width
64-bit
Speed
5500MT/s
Speed
4266MT/s
Bandwidth
44GB/s
Bandwidth
34.1GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
44GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
34.1GB/s

TDP
5W
TDP
5W

iGPU
iGPU
Shaders
768
Shaders
768
Boost Clock
759MHz
Boost Clock
675MHz
··
2.33 TFLOPSFP16
··
2.07 TFLOPSFP16

NPU Model
-
NPU Model
Hexagon 690
NPU Clock
-
NPU Clock
576MHz
Performance
-
Performance
7 TOPS

Modem Model
Balong 5000 4G
Modem Model
X50
Cellular
5G
Cellular
5G mmWave
Peak Down
Up to 4.6Gbps
Peak Down
Up to 5.0Gbps
Peak Up
Up to 2.5Gbps
Peak Up
Up to 210Mbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Kryo 485ARMv8.2-A
Family
-
Family
Branding
Kirin  branding
Branding
Snapdragon 5G  branding
Codename
Cortex-A77P-Core
Cortex-A77M-Core
Cortex-A55E-Core
Codename
Cortex-A76P-Core
Cortex-A76M-Core
Cortex-A55E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Oct 1, 2020
Release Date
Mar 25, 2021

Foundry
-
Foundry
TSMC
Fabrication Node
-
Fabrication Node
N7