CPUs

HiSilicon Kirin 910 vs Qualcomm Snapdragon 210 Full Specs

4 Cores
4 Threads
1.6GHz
4 Cores
4 Threads
1.1GHz
TDP
5W
TDP
5W
Bandwidth
6.4GB/s
LPDDR3
Bandwidth
4.3GB/s
LPDDR2
iGPU
iGPU
··
17.06 GFLOPSFP32
··
38.4 GFLOPSFP16

4 Cores
4 Cores
4 Threads
4 Threads

Base Clock
1.6GHz
Base Clock
1.1GHz
Overclocking
Locked
Overclocking
Locked

L1i
16KB
L1i
16KB
L1d
16KB
L1d
16KB
L2
1MB shared
L2
512KB shared

Type
LPDDR3
Type
LPDDR2
Max Memory
-
Max Memory
4GB
ECC
No
ECC
No
Channels
1
Channels
1
Bus Width
32-bit
Bus Width
32-bit
Speed
1600MT/s
Speed
1066MT/s
Bandwidth
6.4GB/s
Bandwidth
4.3GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
6.4GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
4.3GB/s

TDP
5W
TDP
5W

iGPU
iGPU
Shaders
16
Shaders
24
Boost Clock
533MHz
Boost Clock
400MHz
··
17.06 GFLOPSFP32
··
38.4 GFLOPSFP16

NPU Model
-
NPU Model
Hexagon 536

Modem Model
Balong 710
Modem Model
X5
Peak Down
Up to 150Mbps
Peak Down
Up to 150Mbps
Peak Up
Up to 50Mbps
Peak Up
Up to 50Mbps

Manufacturer
Manufacturer
ISA
AArch32
ISA
AArch32
Architecture
Architecture
Family
-
Family
Branding
Kirin  branding
Branding
Snapdragon M  branding
Codename
Cortex-A9P-Core
Codename
Cortex-A7P-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Apr 1, 2014
Release Date
Sep 9, 2014

Foundry
Samsung
Foundry
Samsung
Fabrication Node
45nm
Fabrication Node
45nm