HiSilicon Kirin 910 vs Qualcomm Snapdragon 410 Full Specs

Summary

4 Cores 4 Threads 1.6GHz	4 Cores 4 Threads 1.2GHz
TDP 5W	TDP 5W
Bandwidth 6.4GB/s LPDDR3	Bandwidth 4.3GB/s LPDDR2
iGPU Mali-450 MP4 533MHz	iGPU Adreno 306
Peak·FP32·FP16 17.06 GFLOPSFP32	Peak·FP32·FP16 43.2 GFLOPSFP16

Core Config

4 Cores	4 Cores
4 Threads	4 Threads

Clocks

Base Clock 1.6GHz	Base Clock 1.2GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 16KB	L1i 32KB
L1d 16KB	L1d 32KB
L2 1MB shared	L2 1MB shared

Memory

Type LPDDR3	Type LPDDR2
Max Memory -	Max Memory 4GB
ECC No	ECC No
Channels 1	Channels 1
Bus Width 32-bit	Bus Width 32-bit
Speed 1600MT/s	Speed 1066MT/s
Bandwidth 6.4GB/s	Bandwidth 4.3GB/s
Bandwidth Calculator Channels Transfer Rate1600MT/s UC·Spec·OC 6.4GB/s	Bandwidth Calculator Channels Transfer Rate1066MT/s UC·Spec·OC 4.3GB/s

Power & Thermals

TDP 5W

TDP 5W

iGPU

iGPU Mali-450 MP4 533MHz	iGPU Adreno 306
Shaders 16	Shaders 24
Boost Clock 533MHz	Boost Clock 450MHz
Peak·FP32·FP16 17.06 GFLOPSFP32	Peak·FP32·FP16 43.2 GFLOPSFP16

NPU

NPU Model -

NPU Model Hexagon QDSP6 V5

Cellular

Modem Model Balong 710	Modem Model -
Peak Down Up to 150Mbps	Peak Down -
Peak Up Up to 50Mbps	Peak Up -

Chip

Manufacturer HiSilicon	Manufacturer Qualcomm
ISA AArch32	ISA AArch64
Architecture ARMv7-A	Architecture ARMv8.0-A
Family -	Family 4 Series
Branding	Branding
Codename Cortex-A9P-Core	Codename Cortex-A53P-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date Apr 1, 2014	Release Date Sep 9, 2014

Fabrication

Foundry Samsung	Foundry Samsung
Fabrication Node 45nm	Fabrication Node 28nm LP

Images

Competitors

HiSiliconKirin 910 vs CPU QualcommSnapdragon 210 HiSiliconKirin 910 vs QualcommSnapdragon 410 HiSiliconKirin 910 vs CPU QualcommSnapdragon 410 X5 Show 12 more

QualcommSnapdragon 410 vs CPU QualcommSnapdragon 410 X5 QualcommSnapdragon 410 vs CPU QualcommSnapdragon 412 QualcommSnapdragon 410 vs CPU QualcommSnapdragon 400 (APQ8026) Show 12 more