IBM Cell Broadband Engine E vs AMD Oberon Plus Full Specs

Summary

8 Cores(1P+7E) 9 Threads(2P+7E) 3.2GHz	8 Cores 16 Threads 3.5GHz
TDP -	TDP 180W
Bandwidth 25.6GB/s XDR	Bandwidth -
iGPU -	iGPU Oberon
Peak·FP32·FP16 -	Peak·FP32·FP16 20.58 TFLOPSFP16

Highlights

Max Bandwidth

Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Cell Broadband Engine E25.6GB/s

x1

Oberon Plus-

-

Core Config

8 Cores 1P 7E	8 Cores 8P -
9 Threads 2P 7E	16 Threads 16P -

Clocks

Base Clock 3.2GHz	Base Clock 3.5GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P	L1i 32KB P
L1d 32KB P	L1d 32KB P
L2 512KB P 256KB E	L2 512KB P -
L3 -	L3 64MB

Memory

Type XDR	Type -
Max Memory 256MB	Max Memory -
ECC No	ECC -
Channels 4	Channels -
Bus Width 64-bit	Bus Width -
Speed 3200MT/s	Speed -
Bandwidth 25.6GB/s	Bandwidth -
Bandwidth Calculator Channels Transfer Rate3200MT/s Calculated Bandwidth 25.6GB/s	Bandwidth Calculator -

Power & Thermals

TDP -

TDP 180W

Chipset Bus

Bus Type FSB	Bus Type -
Bus Config 128-bit	Bus Config -
Bus Speed 1.6GT/s	Bus Speed -
Bus Bandwidth 25.6GB/s	Bus Bandwidth -

iGPU

iGPU -	iGPU Oberon
Shaders -	Shaders 2304
Boost Clock -	Boost Clock 2.23GHz
Peak·FP32·FP16 -	Peak·FP32·FP16 20.58 TFLOPSFP16

Chip

Manufacturer IBM	Manufacturer AMD
ISA PowerPC	ISA x86-64
Architecture Cell	Architecture Zen 2
Branding	Branding
Codename Cell-E PPEP-Core SPEE-Core	Codename Oberon - -
Market Segment Console	Market Segment Console
Release Date Aug 8, 2008	Release Date Nov 12, 2020

Fabrication

Foundry IBM	Foundry TSMC
Fabrication Node 65nm	Fabrication Node N7
Die Size 175mm²	Die Size 308mm²
Transistor Count -	Transistor Count 10.6 Billion
Transistor Density -	Transistor Density 34 MTr/mm²

Images

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Competitors

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