IBM Cell Broadband Engine vs Sony Emotion Engine Full Specs

Summary

8 Cores(1P+7E) 9 Threads(2P+7E) 3.2GHz	1 Cores 2 Threads 300MHz
TDP -	TDP 15W
Bandwidth 25.6GB/s XDR	Bandwidth 3.2GB/s RDRAM
Socket -	Socket 540 PBGA

Highlights

Max Bandwidth

Max Bandwidth TDP

Cell Broadband Engine25.6GB/s

x8.00

Emotion Engine3.2GB/s

x1

Core Config

8 Cores 1P 7E	1 Cores 1P -
9 Threads 2P 7E	2 Threads 2P -

Clocks

Base Clock 3.2GHz	Base Clock 300MHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P	L1i 16KB P
L1d 32KB P	L1d 8KB P
L2 512KB P 256KB E	L2 16KB P -

Memory

Type XDR	Type RDRAM
Max Memory 256MB	Max Memory 32MB
ECC No	ECC No
Channels 4	Channels 2
Bus Width 64-bit	Bus Width 32-bit
Speed 3200MT/s	Speed 800MT/s
Bandwidth 25.6GB/s	Bandwidth 3.2GB/s
Bandwidth Calculator Channels Transfer Rate3200MT/s Calculated Bandwidth 25.6GB/s	Bandwidth Calculator Channels Transfer Rate800MT/s Calculated Bandwidth 3.2GB/s

Power & Thermals

TDP -

TDP 15W

Chipset Bus

Bus Type FSB	Bus Type FSB
Bus Config 128-bit	Bus Config 128-bit
Bus Speed 1.6GT/s	Bus Speed 150MT/s
Bus Bandwidth 25.6GB/s	Bus Bandwidth 2.4GB/s

Chip

Manufacturer IBM	Manufacturer Sony
ISA PowerPC	ISA MIPS III
Architecture Cell	Architecture MIPS
Branding	Branding
Codename Cell PPEP-Core SPEE-Core	Codename EE MIPS R5900P-Core -
Market Segment Console	Market Segment Console
Release Date Nov 11, 2006	Release Date Mar 4, 2000

Fabrication

Foundry IBM	Foundry Sony
Fabrication Node 90nm	Fabrication Node 250nm
Die Size 235mm²	Die Size 240mm²
Transistor Count -	Transistor Count 11 Million

Images

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