CPUs

Sony Emotion Engine vs AMD Ryzen Z2 Go Full Specs

1 Cores
2 Threads
300MHz
4 Cores(2P+2E)
8 Threads(4P+4E)
3GHz
TDP
15W
TDP
28W
Bandwidth
3.2GB/s
RDRAM
Bandwidth
120GB/s
·
iGPU
0
iGPU
··
-
··
2.87 TFLOPSFP16
Socket
Socket

Emotion EngineEmotion Engine-
-
Ryzen Z2 GoRyzen Z2 Go3.3GHz
x1

1 Cores
1P
-
4 Cores
2P
2E
2 Threads
2P
-
8 Threads
4P
4E

Base Clock
300MHz
Base Clock
3GHz
Boost Clock
-
Boost Clock
4.3GHz
Overclocking
Locked
Overclocking
Locked

L1i
16KB P
L1i
32KB P
L1d
8KB P
L1d
32KB P
L2
16KB P
L2
1MB P
L3
-
L3
16MB

Type
RDRAM
Type
·
Max Memory
32MB
Max Memory
128GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
32-bit
Bus Width
128-bit
Speed
800MT/s
Speed
7500MT/s
Bandwidth
3.2GB/s
Bandwidth
120GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
3.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
120GB/s

TDP
15W
TDP
28W
cTDP-down
-
cTDP-down
15W
cTDP-up
-
cTDP-up
30W
Max Operating Temp
-
Max Operating Temp
100°C Max
Included Cooler
-
Included Cooler
0

Bus Type
FSB
Bus Type
PCIe
Bus Config
128-bit
Bus Config
4 lanes
Bus Speed
150MT/s
Bus Speed
16GT/s
Bus Bandwidth
2.4GB/s
Bus Bandwidth
8GB/s

-
PCIe
PCIe 4.0 x14
27.6GB/sBandwidth

iGPU
0
iGPU
Shaders
-
Shaders
256
Boost Clock
-
Boost Clock
2.8GHz
··
-
··
2.87 TFLOPSFP16

Manufacturer
Manufacturer
ISA
MIPS III
ISA
x86-64
Architecture
Architecture
Family
-
Family
Branding
PlayStation  branding
Branding
Z2 Go 2024 branding
Codename
EE
MIPS R5900P-Core
-
Codename
Phoenix 2
Zen 4P-Core
Zen 4cE-Core
Market Segment
Console
Market Segment
Console
Release Date
Mar 4, 2000
Release Date
Jan 6, 2025

Foundry
Sony
Foundry
TSMC
Fabrication Node
250nm
Fabrication Node
N4
Die Size
240mm²
Die Size
137mm²
Transistor Count
11 Million
Transistor Count
20.9 Billion
Transistor Density
-
Transistor Density
153 MTr/mm²

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