Intel Core i3-13300HE vs NVIDIA AGX Orin 32GB Full Specs

Summary

8 Cores(4P+4E) 12 Threads(8P+4E) 2.1GHz	8 Cores 8 Threads 2.2GHz
TDP 45W	TDP 40W
Bandwidth 102.4GB/s LPDDR5X·DDR5·LPDDR4X·DDR4	Bandwidth 204.8GB/s LPDDR5
iGPU UHD 48EU 1300MHz Gen 12	iGPU GA10B 28SM
Peak·FP32·FP16 2 TFLOPSFP16	Peak·FP32·FP16 213.3 TFLOPSFP16
Socket BGA 1744	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi E-Core Boost Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core i3-13300HE2,100

x1

AGX Orin 32GB-

-

Show Top Score

Core Config

8 Cores 4P 4E	8 Cores 8P -
12 Threads 8P 4E	8 Threads 8P -

Clocks

Base Clock 2.1GHz	Base Clock 2.2GHz
Boost Clock 4.6GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P 64KB E	L1i 64KB P -
L1d 48KB P 32KB E	L1d 64KB P -
L2 1.25MB P 2MB E shared	L2 256KB P -
L3 12MB	L3 4MB
SLC Cache -	SLC Cache 4MB

Memory

Type LPDDR5X·DDR5·LPDDR4X·DDR4	Type LPDDR5
Max Memory 64GB	Max Memory -
ECC No	ECC No
Channels 2	Channels 4
Bus Width 128-bit	Bus Width 256-bit
Speed 6400MT/s	Speed 6400MT/s
Bandwidth 102.4GB/s	Bandwidth 204.8GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 102.4GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 204.8GB/s

Power & Thermals

TDP 45W	TDP 40W
cTDP-down -	cTDP-down 15W
Peak Power 115W	Peak Power -
Max Operating Temp 100°C Max	Max Operating Temp -

Chipset Bus

Bus Type DMI	Bus Type -
Bus Config 8 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 16GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 5.0 x16 63GB/sBandwidth	-
PCIe Secondary PCIe 4.0 x8 15.8GB/sBandwidth	-

iGPU

iGPU UHD 48EU 1300MHz Gen 12	iGPU GA10B 28SM
Shaders 384	Shaders 1792
Boost Clock 1.3GHz	Boost Clock 930MHz
Peak·FP32·FP16 2 TFLOPSFP16	Peak·FP32·FP16 213.3 TFLOPSFP16

NPU

NPU Model GNA 3.0	NPU Model NVDLA 2.0
NPU Cores -	NPU Cores 2
NPU Clock -	NPU Clock 1.4GHz
Performance -	Performance 93.3 TOPSINT8

Chip

Manufacturer Intel	Manufacturer NVIDIA
ISA x86-64	ISA AArch64
Architecture Raptor Lake	Architecture ARMv8.2-A
Family Core 13th Gen	Family -
Branding	Branding
Codename Raptor Lake-H Raptor Lake-6P-8EVariant Golden CoveP-Core GracemontE-Core	Codename Hercules - Cortex-A78AEP-Core -
Market Segment Embedded	Market Segment Embedded
Release Date Jan 1, 2023	Release Date Oct 1, 2022

Fabrication

Foundry Intel	Foundry Samsung
Fabrication Node Intel 7	Fabrication Node 8N
Die Size 208mm²	Die Size -
Transistor Count 15.2 Billion	Transistor Count 17 Billion
Transistor Density 73 MTr/mm²	Transistor Density -

Images

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Competitors

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