NVIDIA AGX Orin 32GB vs Intel Core i3-13300HE Full Specs

Summary

8 Cores 8 Threads 2.2GHz	8 Cores(4P+4E) 12 Threads(8P+4E) 2.1GHz
TDP 40W	TDP 45W
Bandwidth 204.8GB/s LPDDR5	Bandwidth 102.4GB/s LPDDR5X·DDR5·LPDDR4X·DDR4
iGPU GA10B 28SM	iGPU UHD 48EU 1300MHz Gen 12
Peak·FP32·FP16 213.3 TFLOPSFP16	Peak·FP32·FP16 2 TFLOPSFP16
Socket -	Socket BGA 1744

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi E-Core Boost Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

AGX Orin 32GB-

-

Core i3-13300HE2,100

x1

Show Top Score

Core Config

8 Cores 8P -	8 Cores 4P 4E
8 Threads 8P -	12 Threads 8P 4E

Clocks

Base Clock 2.2GHz	Base Clock 2.1GHz
Boost Clock -	Boost Clock 4.6GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P -	L1i 32KB P 64KB E
L1d 64KB P -	L1d 48KB P 32KB E
L2 256KB P -	L2 1.25MB P 2MB E shared
L3 4MB	L3 12MB
SLC Cache 4MB	SLC Cache -

Memory

Type LPDDR5	Type LPDDR5X·DDR5·LPDDR4X·DDR4
Max Memory -	Max Memory 64GB
ECC No	ECC No
Channels 4	Channels 2
Bus Width 256-bit	Bus Width 128-bit
Speed 6400MT/s	Speed 6400MT/s
Bandwidth 204.8GB/s	Bandwidth 102.4GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 204.8GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 102.4GB/s

Power & Thermals

TDP 40W	TDP 45W
cTDP-down 15W	cTDP-down -
Peak Power -	Peak Power 115W
Max Operating Temp -	Max Operating Temp 100°C Max

Chipset Bus

Bus Type -	Bus Type DMI
Bus Config -	Bus Config 8 lanes
Bus Speed -	Bus Speed 16GT/s
Bus Bandwidth -	Bus Bandwidth 16GB/s

Expansion

-	PCIe PCIe 5.0 x16 63GB/sBandwidth
-	PCIe Secondary PCIe 4.0 x8 15.8GB/sBandwidth

iGPU

iGPU GA10B 28SM	iGPU UHD 48EU 1300MHz Gen 12
Shaders 1792	Shaders 384
Boost Clock 930MHz	Boost Clock 1.3GHz
Peak·FP32·FP16 213.3 TFLOPSFP16	Peak·FP32·FP16 2 TFLOPSFP16

NPU

NPU Model NVDLA 2.0	NPU Model GNA 3.0
NPU Cores 2	NPU Cores -
NPU Clock 1.4GHz	NPU Clock -
Performance 93.3 TOPSINT8	Performance -

Chip

Manufacturer NVIDIA	Manufacturer Intel
ISA AArch64	ISA x86-64
Architecture ARMv8.2-A	Architecture Raptor Lake
Family -	Family Core 13th Gen
Branding	Branding
Codename Hercules - Cortex-A78AEP-Core -	Codename Raptor Lake-H Raptor Lake-6P-8EVariant Golden CoveP-Core GracemontE-Core
Market Segment Embedded	Market Segment Embedded
Release Date Oct 1, 2022	Release Date Jan 1, 2023

Fabrication

Foundry Samsung	Foundry Intel
Fabrication Node 8N	Fabrication Node Intel 7
Die Size -	Die Size 208mm²
Transistor Count 17 Billion	Transistor Count 15.2 Billion
Transistor Density -	Transistor Density 73 MTr/mm²

Images

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Competitors

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