Intel Core i3-6167U vs AMD Ryzen 3 5125C Full Specs

Summary

2 Cores 4 Threads 2.7GHz	2 Cores 4 Threads 3GHz
TDP 28W	TDP 15W
Bandwidth 34.1GB/s DDR4·LPDDR3·DDR3L	Bandwidth 68.3GB/s LPDDR4X·DDR4
iGPU Iris 550 1000MHz	iGPU Radeon Vega 3 1400MHz
Peak·FP32·FP16 768 GFLOPSFP32	Peak·FP32·FP16 1.07 TFLOPSFP16
Socket BGA 1356	Socket FP6

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Core i3-6167U900

x1

Ryzen 3 5125C1,266

x1.41

Show Top Score

Core Config

2 Cores	2 Cores
4 Threads	4 Threads

Clocks

Base Clock 2.7GHz	Base Clock 3GHz
Boost Clock -	Boost Clock 3GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB	L1i 32KB
L1d 32KB	L1d 32KB
L2 256KB	L2 512KB
L3 3MB	L3 8MB
L4 Cache 64MB	L4 Cache -

Memory

Type DDR4·LPDDR3·DDR3L	Type LPDDR4X·DDR4
Max Memory 64GB	Max Memory 32GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 2133MT/s	Speed 4266MT/s
Bandwidth 34.1GB/s	Bandwidth 68.3GB/s
Bandwidth Calculator Channels Transfer Rate2133MT/s UC·Spec·OC 34.1GB/s	Bandwidth Calculator Channels Transfer Rate4266MT/s UC·Spec·OC 68.3GB/s

Power & Thermals

TDP 28W	TDP 15W
cTDP-down 23W	cTDP-down -
Max Operating Temp 100°C Max	Max Operating Temp 95°C Max
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type OPI	Bus Type PCIe
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 4GT/s	Bus Speed 8GT/s
Bus Bandwidth 2GB/s	Bus Bandwidth 4GB/s

Expansion

PCIe PCIe 3.0 x12 11.8GB/sBandwidth

PCIe PCIe 3.0 x16 15.8GB/sBandwidth

iGPU

iGPU Iris 550 1000MHz	iGPU Radeon Vega 3 1400MHz
Shaders 384	Shaders 192
Boost Clock 1GHz	Boost Clock 1.4GHz
Peak·FP32·FP16 768 GFLOPSFP32	Peak·FP32·FP16 1.07 TFLOPSFP16

Controller

Controller Model 100 Series U+	Controller Model -
Codename Skylake	Codename -
PCIe -	PCIe -

Chip

Manufacturer Intel	Manufacturer AMD
ISA x86-64	ISA x86-64
Architecture Skylake	Architecture Zen 3
Family Core 6th Gen	Family Ryzen 5000
Branding	Branding
Codename Skylake-U Skylake-2C-GT3Variant	Codename Barcelo -
Market Segment Laptop	Market Segment Laptop
Release Date Sep 1, 2015	Release Date May 5, 2022

Fabrication

Foundry Intel	Foundry TSMC
Other Foundries InteleDRAM IntelPCH	Other Foundries -
Fabrication Node 14nm 22nmeDRAM 22nmPCH	Fabrication Node N7 - -
Die Size 148mm² 42mm²eDRAM 50mm²PCH	Die Size 180mm² - -
Transistor Count 2.5B	Transistor Count 10.7B
Transistor Density 17 MTr/mm²	Transistor Density 59 MTr/mm²

Images

Competitors

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