Intel Core i5-1135G7

Core i5-1135G7

Intel Core Ultra 5 226V

Core Ultra 5 226V

Intel Core i5-1135G7 vs Intel Core Ultra 5 226V Full Specs

4 Cores
8 Threads
1.4GHz
8 Cores(4P+4E)
8 Threads(4P+4E)
2.1GHz
TDP
15W
TDP
17W
Bandwidth
59.7GB/s
·
Bandwidth
136.5GB/s
LPDDR5X
iGPU
iGPU
··
3.33 TFLOPSFP16
··
106.1 TOPSINT4 Tensor
Socket
Socket

Core i5-1135G7Core i5-1135G7
x1
Core Ultra 5 226VCore Ultra 5 226V
x1.52

4 Cores
4P
-
8 Cores
4P
4E
8 Threads
8P
-
8 Threads
4P
4E

Base Clock
1.4GHz
Base Clock
2.1GHz
Boost Clock
4.2GHz
Boost Clock
4.5GHz
Overclocking
Locked
Overclocking
Locked

L0i
-
L0i
64KB
L0d
-
L0d
48KB
L1i
32KB P
-
L1i
-
64KB E
L1d
48KB P
-
L1d
192KB P
32KB E
L2
1.25MB P
-
L2
2.5MB P
4MB E shared
L3
8MB
L3
8MB

Type
·
Type
LPDDR5X
Max Memory
32GB
Max Memory
16GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
128-bit
Bus Width
128-bit
Speed
3733MT/s
Speed
8533MT/s
Bandwidth
59.7GB/s
Bandwidth
136.5GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
59.7GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
136.5GB/s

TDP
15W
TDP
17W
cTDP-down
12W
cTDP-down
8W
cTDP-up
28W
cTDP-up
-
Peak Power
-
Peak Power
37W
Max Operating Temp
100°C Max
Max Operating Temp
100°C Max

Bus Type
OPI
Bus Type
-
Bus Config
8 lanes
Bus Config
-
Bus Speed
4GT/s
Bus Speed
-
Bus Bandwidth
4GB/s
Bus Bandwidth
-

PCIe
PCIe 4.0 x4
7.9GB/sBandwidth
PCIe
PCIe 5.0 x4
15.8GB/sBandwidth
-
PCIe Secondary
PCIe 4.0 x4
7.9GB/sBandwidth

iGPU
iGPU
Shaders
640
Shaders
896
Boost Clock
1.3GHz
Boost Clock
1.85GHz
··
3.33 TFLOPSFP16
··
106.1 TOPSINT4 Tensor

NPU Model
GNA 2.0
NPU Model
AI Boost 4
NPU Cores
-
NPU Cores
5
Performance
-
Performance
40 TOPSINT8

Controller Model
500 Series UP3+
Controller Model
-
Codename
Tiger Lake
Codename
-
PCIe
-
PCIe
-

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Core i5 2020 branding
Branding
Core Ultra 5 2023 branding
Codename
Tiger Lake-UP3
Tiger Lake-4C-GT3Variant
Willow CoveP-Core
-
Codename
Lunar Lake-V
Lunar Lake-MXVariant
Lion CoveP-Core
SkymontE-Core
Market Segment
Laptop
Market Segment
Laptop
Release Date
Sep 2, 2020
Release Date
Sep 3, 2024
Part Number
FH8069004530601, FH8069004531301
Part Number
QQ8076606107, QQ8076606108
S-Spec
SRK04 (B1), SRK05 (B1)
S-Spec
SRPMQ, SRPMR

Foundry
Intel
Foundry
TSMC
Other Foundries
-
-
IntelPCH
Other Foundries
IntelFIB
TSMCIO
-
Fabrication Node
10nm SuperFin
-
-
14nmPCH
Fabrication Node
N3B
22nmFIB
N6IO
-
Die Size
146mm²
-
55mm²PCH
Die Size
140mm²
46mm²IO
-
Transistor Count
9.5B
Transistor Count
-
Transistor Density
65 MTr/mm²
Transistor Density
-