Intel Core i5-13420H vs Qualcomm Snapdragon X Plus (X1P-64-100) Full Specs

Summary

8 Cores(4P+4E) 12 Threads(8P+4E) 2.1GHz	10 Cores 10 Threads 3.4GHz
TDP 45W	TDP 23W
Bandwidth 102.4GB/s LPDDR5X·DDR5·LPDDR4X·DDR4	Bandwidth 135.2GB/s LPDDR5X
iGPU UHD 48EU 1400MHz Gen 12	iGPU Adreno X1 3.8T
Peak·FP32·FP16 2 TFLOPSFP16	Peak·FP32·FP16 7.68 TFLOPSFP16
Socket BGA 1744	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi E-Core Boost Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core i5-13420H2,292

x1

Snapdragon X Plus (X1P-64-100)2,349

x1.02

Show Top Score

Core Config

8 Cores 4P 4E	10 Cores 10P -
12 Threads 8P 4E	10 Threads 10P -

Clocks

Base Clock 2.1GHz	Base Clock 3.4GHz
Boost Clock 4.6GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P 64KB E	L1i 192KB P -
L1d 48KB P 32KB E	L1d 96KB P -
L2 1.25MB P - 2MB E shared	L2 36MB P shared -
L3 12MB	L3 -
SLC Cache -	SLC Cache 6MB

Memory

Type LPDDR5X·DDR5·LPDDR4X·DDR4	Type LPDDR5X
Max Memory 64GB	Max Memory 64GB
ECC No	ECC No
Channels 2	Channels 8
Bus Width 128-bit	Bus Width 128-bit
Speed 6400MT/s	Speed 8448MT/s
Bandwidth 102.4GB/s	Bandwidth 135.2GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 102.4GB/s	Bandwidth Calculator Channels Transfer Rate8448MT/s Calculated Bandwidth 135.2GB/s

Power & Thermals

TDP 45W	TDP 23W
Peak Power 95W	Peak Power -
Max Operating Temp 100°C Max	Max Operating Temp -

Chipset Bus

Bus Type DMI	Bus Type -
Bus Config 8 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 16GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 5.0 x16 63GB/sBandwidth	PCIe PCIe 4.0 x12 23.6GB/sBandwidth
PCIe Secondary PCIe 4.0 x8 15.8GB/sBandwidth	PCIe Secondary PCIe 3.0 x4 3.9GB/sBandwidth

iGPU

iGPU UHD 48EU 1400MHz Gen 12	iGPU Adreno X1 3.8T
Shaders 384	Shaders 1536
Boost Clock 1.3GHz	Boost Clock 1.25GHz
Peak·FP32·FP16 2 TFLOPSFP16	Peak·FP32·FP16 7.68 TFLOPSFP16

NPU

NPU Model GNA 3.0	NPU Model Hexagon
Performance -	Performance 45 TOPSINT8

Chip

Manufacturer Intel	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Raptor Lake	Architecture OryonARMv8.7-A
Family Core 13th Gen	Family X Series
Branding	Branding
Codename Raptor Lake-H Raptor Lake-6P-8EVariant Golden CoveP-Core GracemontE-Core	Codename Hamoa Snapdragon X EliteVariant PhoenixP-Core -
Market Segment Laptop	Market Segment Laptop
Release Date Jan 1, 2023	Release Date Apr 24, 2024

Fabrication

Foundry Intel	Foundry TSMC
Fabrication Node Intel 7	Fabrication Node N4P
Die Size 208mm²	Die Size 170mm²
Transistor Count 15.2 Billion	Transistor Count -
Transistor Density 73 MTr/mm²	Transistor Density -

Images

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Used In

Laptops Alienware X14(R2, Early 2023)Inspiron 14 Plus(7430, Early 2023)Inspiron 16 Plus(7630, Early 2023)	Laptops XPS 13(9345, Mid 2024)Inspiron 14(5441, Late 2024)Inspiron 14 Plus(7441, Late 2024) Show 2 more
Tablets -	Tablets Surface Pro 11(X Elite, Mid 2024)

Competitors

IntelCore i5-13420H vs CPU IntelCore Ultra 5 235UA IntelCore i5-13420H vs CPU AMDRyzen AI 7 PRO 350 IntelCore i5-13420H vs CPU AMDRyzen AI Max 385 Show 12 more

QualcommSnapdragon X Plus (X1P-64-100) vs CPU QualcommSnapdragon X2 Elite (X2E-80-100) QualcommSnapdragon X Plus (X1P-64-100) vs CPU AMDRyzen AI 7 PRO 350 QualcommSnapdragon X Plus (X1P-64-100) vs CPU AMDRyzen AI 7 350 Show 12 more