Intel Core i5-6260U vs AMD A10-8700P Full Specs

Summary

2 Cores 4 Threads 1.8GHz	2 Cores 4 Threads 1.8GHz
TDP 15W	TDP 35W
Bandwidth 34.1GB/s DDR4·LPDDR3·DDR3L	Bandwidth 34.1GB/s DDR3
iGPU Iris 540 950MHz	iGPU Radeon R6 6CU 800MHz GCN 3
Peak·FP32·FP16 729.6 GFLOPSFP32	Peak·FP32·FP16 614.4 GFLOPSFP16
Socket BGA 1356	Socket FP4

Core Config

2 Cores	2 Cores
4 Threads	4 Threads

Clocks

Base Clock 1.8GHz	Base Clock 1.8GHz
Boost Clock 2.9GHz	Boost Clock 3.2GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB	L1i 96KB
L1d 32KB	L1d 32KB
L2 256KB	L2 1MB
L3 4MB	L3 -
L4 Cache 64MB	L4 Cache -

Memory

Type DDR4·LPDDR3·DDR3L	Type DDR3
Max Memory 64GB	Max Memory 64GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 2133MT/s	Speed 2133MT/s
Bandwidth 34.1GB/s	Bandwidth 34.1GB/s
Bandwidth Calculator Channels Transfer Rate2133MT/s UC·Spec·OC 34.1GB/s	Bandwidth Calculator Channels Transfer Rate2133MT/s UC·Spec·OC 34.1GB/s

Power & Thermals

TDP 15W	TDP 35W
cTDP-down 10W	cTDP-down 12W
Max Operating Temp 100°C Max	Max Operating Temp -
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type OPI	Bus Type PCIe
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 4GT/s	Bus Speed 8GT/s
Bus Bandwidth 2GB/s	Bus Bandwidth 4GB/s

Expansion

PCIe PCIe 3.0 x12 11.8GB/sBandwidth

PCIe PCIe 3.0 x8 7.9GB/sBandwidth

iGPU

iGPU Iris 540 950MHz	iGPU Radeon R6 6CU 800MHz GCN 3
Shaders 384	Shaders 384
Boost Clock 950MHz	Boost Clock 800MHz
Peak·FP32·FP16 729.6 GFLOPSFP32	Peak·FP32·FP16 614.4 GFLOPSFP16

Controller

Controller Model 100 Series U+	Controller Model -
Codename Skylake	Codename -
PCIe -	PCIe -

Chip

Manufacturer Intel	Manufacturer AMD
ISA x86-64	ISA x86-64
Architecture Skylake	Architecture Excavator
Family Core 6th Gen	Family A Series
Branding	Branding
Codename Skylake-SP Skylake-2C-GT3Variant	Codename Carrizo -
Market Segment Laptop	Market Segment Laptop
Release Date Sep 1, 2015	Release Date Jun 1, 2015

Fabrication

Foundry Intel	Foundry GlobalFoundries
Other Foundries InteleDRAM IntelPCH	Other Foundries -
Fabrication Node 14nm 22nmeDRAM 22nmPCH	Fabrication Node 28nm - -
Die Size 148mm² 42mm²eDRAM 50mm²PCH	Die Size 250mm² - -
Transistor Count 2.5 Billion	Transistor Count 3.1 Billion
Transistor Density 17 MTr/mm²	Transistor Density 12 MTr/mm²

Images

Competitors

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