Intel Core i7-13700TE vs NVIDIA Grace Blackwell GB10 Full Specs

Summary

16 Cores(8P+8E) 24 Threads(16P+8E) 1.1GHz	20 Cores(10P+10E) 20 Threads(10P+10E) 3GHz
TDP 35W	TDP 150W
Bandwidth 89.6GB/s DDR5·DDR4	Bandwidth 273.1GB/s LPDDR5X
iGPU UHD 770 1600MHz	iGPU GB10
Peak·FP32·FP16 1.64 TFLOPSFP16	Peak·FP32·FP16 992.9 TFLOPSFP16
Socket LGA 1700	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi E-Core Boost Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Core i7-13700TE2,139

x1

Grace Blackwell GB10-

-

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Core Config

16 Cores 8P 8E	20 Cores 10P 10E
24 Threads 16P 8E	20 Threads 10P 10E

Clocks

Base Clock 1.1GHz	Base Clock 3GHz
Boost Clock 4.8GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P 64KB E	L1i 64KB P -
L1d 48KB P 32KB E	L1d 64KB P -
L2 2MB P 8MB E shared	L2 1MB P -
L3 30MB	L3 -

Memory

Type DDR5·DDR4	Type LPDDR5X
Max Memory 128GB	Max Memory 128GB
ECC No	ECC No
Channels 2	Channels 4
Bus Width 128-bit	Bus Width 256-bit
Speed 5600MT/s	Speed 8533MT/s
Bandwidth 89.6GB/s	Bandwidth 273.1GB/s
Bandwidth Calculator Channels Transfer Rate5600MT/s Calculated Bandwidth 89.6GB/s	Bandwidth Calculator Channels Transfer Rate8533MT/s Calculated Bandwidth 273.1GB/s

Power & Thermals

TDP 35W	TDP 150W
Max Operating Temp 100°C Max	Max Operating Temp -

Chipset Bus

Bus Type DMI	Bus Type -
Bus Config 8 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 16GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 5.0 x16 63GB/sBandwidth	-
PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth	-

iGPU

iGPU UHD 770 1600MHz	iGPU GB10
Shaders 256	Shaders 6144
Boost Clock 1.6GHz	Boost Clock 2.52GHz
Peak·FP32·FP16 1.64 TFLOPSFP16	Peak·FP32·FP16 992.9 TFLOPSFP16

NPU

NPU Model GNA 3.0

NPU Model -

Chip

Manufacturer Intel	Manufacturer NVIDIA
ISA x86-64	ISA AArch64
Architecture Raptor Lake	Architecture ARMv9.2-A
Family Core 13th Gen	Family -
Branding	Branding
Codename Raptor Lake-HX - Raptor Lake-8P-16EVariant Raptor CoveP-Core GracemontE-Core	Codename Grace Blackwell GB10Die Grace Blackwell GB10Variant Cortex-X925P-Core Cortex-A725E-Core
Market Segment Embedded	Market Segment Embedded
Release Date Jan 1, 2023	Release Date Jan 6, 2025

Fabrication

Foundry Intel	Foundry TSMC
Fabrication Node Intel 7	Fabrication Node N3E
Die Size 257mm²	Die Size -
Transistor Count 18.5 Billion	Transistor Count -
Transistor Density 72 MTr/mm²	Transistor Density -

Images

No images available

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Used In

Desktops -

Desktops DGX Spark(Late 2025)

Competitors

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