Intel Core i7-13800HE vs NVIDIA AGX Orin 64GB Full Specs

Summary

14 Cores(6P+8E) 20 Threads(12P+8E) 2.5GHz	12 Cores 12 Threads 2.2GHz
TDP 45W	TDP 60W
Bandwidth 102.4GB/s LPDDR5X·DDR5·LPDDR4X·DDR4	Bandwidth 204.8GB/s LPDDR5
iGPU Iris Xe 96EU 1400MHz	iGPU GA10B 32SM
Peak·FP32·FP16 4.3 TFLOPSFP16	Peak·FP32·FP16 340.8 TOPSINT4 Tensor Sparse
Socket BGA 1744	Socket -

Core Config

14 Cores 6P 8E	12 Cores 12P -
20 Threads 12P 8E	12 Threads 12P -

Clocks

Base Clock 2.5GHz	Base Clock 2.2GHz
Boost Clock 5GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P 64KB E	L1i 64KB P -
L1d 48KB P 32KB E	L1d 64KB P -
L2 1.25MB P 4MB E shared	L2 256KB P -
L3 24MB	L3 6MB
SLC Cache -	SLC Cache 4MB

Memory

Type LPDDR5X·DDR5·LPDDR4X·DDR4	Type LPDDR5
Max Memory 64GB	Max Memory -
ECC No	ECC No
Channels 2	Channels 4
Bus Width 128-bit	Bus Width 256-bit
Speed 6400MT/s	Speed 6400MT/s
Bandwidth 102.4GB/s	Bandwidth 204.8GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s UC·Spec·OC 102.4GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s UC·Spec·OC 204.8GB/s

Power & Thermals

TDP 45W	TDP 60W
cTDP-down -	cTDP-down 15W
Peak Power 115W	Peak Power -
Max Operating Temp 100°C Max	Max Operating Temp -

Chipset Bus

Bus Type DMI	Bus Type -
Bus Config 8 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 16GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 5.0 x16 63GB/sBandwidth	-
PCIe Secondary PCIe 4.0 x8 15.8GB/sBandwidth	-

iGPU

iGPU Iris Xe 96EU 1400MHz	iGPU GA10B 32SM
Shaders 768	Shaders 2048
Boost Clock 1.4GHz	Boost Clock 1.3GHz
Peak·FP32·FP16 4.3 TFLOPSFP16	Peak·FP32·FP16 340.8 TOPSINT4 Tensor Sparse

NPU

NPU Model GNA 3.0	NPU Model NVDLA 2.0
NPU Cores -	NPU Cores 2
NPU Clock -	NPU Clock 1.6GHz
Performance -	Performance 105 TOPSINT8

Chip

Manufacturer Intel	Manufacturer NVIDIA
ISA x86-64	ISA AArch64
Architecture Raptor Lake	Architecture ARMv8.2-A
Family Core 13th Gen	Family -
Branding	Branding
Codename Raptor Lake-H Raptor Lake-6P-8EVariant Golden CoveP-Core GracemontE-Core	Codename Hercules - Cortex-A78AEP-Core -
Market Segment Embedded	Market Segment Embedded
Release Date Jan 1, 2023	Release Date Jan 1, 2021

Fabrication

Foundry Intel	Foundry Samsung
Fabrication Node Intel 7	Fabrication Node 8N
Die Size 208mm²	Die Size -
Transistor Count 15.2 Billion	Transistor Count 17 Billion
Transistor Density 73 MTr/mm²	Transistor Density -

Images

Competitors

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