Intel Iris Xe 96EU 1400MHz vs NVIDIA GA10B 32SM Full Specs

Summary

768 Shaders 1.4GHz	2,048 Shaders 1.3GHz
Shared Memory102.4GB/s LPDDR5X·DDR5·LPDDR5·LPDDR4X·DDR4	Shared Memory204.8GB/sLPDDR5
Peak·FP32·FP16 2.15 TFLOPS	Peak·FP32·FP16 5.33 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Theoretical Performance

Clock Speed1400MHz UC·Boost·OC	Clock Speed1300MHz UC·Boost·OC
Peak OPS 4.3 TFLOPSFP16	Peak OPS 340.8 TOPSINT4 Tensor Sparse
-	Tensor FP16-16 42.6 TFLOPS FP16-16 Tensor Sparse 85.2 TFLOPS Tensor FP16-32 42.6 TFLOPS FP16-32 Tensor Sparse 85.2 TFLOPS
-	Tensor BF16 42.6 TFLOPS BF16 Tensor Sparse 85.2 TFLOPS
Tensor TF32 -	Tensor TF32 21.3 TFLOPS
FP32 2.15 TFLOPS	FP32 5.33 TFLOPS
FP64 537.6 GFLOPS	-
Tensor INT4 -	Tensor INT4 170.4 TOPS
-	Tensor INT8 85.2 TOPS
Pixel Rate 33.6 GPixel/s	Pixel Rate 41.6 GPixel/s
Texture Rate 67.2 GTexel/s	Texture Rate 20.8 GTexel/s

Core Config

Shaders 768 Shaders	Shaders 2,048 Shaders
TMUs 48 TMUs	TMUs 16 TMUs
ROPs 24 ROPs	ROPs 32 ROPs
Tensor Cores -	Tensor Cores 64 T-Cores
EUs 96 EUs	SMs 16 SMs

Clocks

Boost Clock 1.4GHz

Boost Clock 1.3GHz

Cache

L2 Cache 1MB shared	L2 Cache 4MB shared
L3 Cache 4MB shared	L3 Cache -

Memory

Shared Memory LPDDR5X·DDR5·LPDDR5·LPDDR4X·DDR4	Shared MemoryLPDDR5
Memory Bus 128-bit	Memory Bus 256-bit
Memory Speed 6.4GT/s	Memory Speed 6.4GT/s
Memory Bandwidth 102.4GB/s	Memory Bandwidth 204.8GB/s
ECC No	ECC No

Video Output

Multi-Monitor 4

Multi-Monitor -

Encoder

Encoder Model Quick Sync Video 8	Encoder Model NVENC 7
Codec JPEG VP9 AVC (H.264) HEVC (H.265) AV1	Codec - - AVC (H.264) HEVC (H.265) -

Decoder

Decoder Model Quick Sync Video 8	Decoder Model NVDEC 5
Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1	Codec MPEG-1 MPEG-2 MPEG-4 - VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer Intel	Manufacturer NVIDIA
Chip Designer Intel	Chip Designer NVIDIA
Architecture Gen 12	Architecture Ampere
Family Gen 12	Family Jetson
Branding	Branding
Codename Xe LP	Codename Hercules
Chip Variant GT1	Chip Variant -
Market Segment Laptop	Market Segment Embedded
Release Date Jun 22, 2021	Release Date Jan 1, 2021

Fabrication

Foundry Intel	Foundry Samsung
Fabrication Node Intel 7	Fabrication Node 8N
Die Size 208mm²	Die Size -
Transistor Count 15.2 Billion	Transistor Count 17 Billion
Transistor Density 73 MTr/mm²	Transistor Density -

Images