Intel Core i7-2760QM vs AMD Ryzen 3 PRO 210 Full Specs

Summary

4 Cores 8 Threads 2.4GHz	4 Cores(1P+3E) 8 Threads(2P+6E) 3GHz
TDP 45W	TDP 28W
Bandwidth 25.6GB/s DDR3	Bandwidth 120GB/s LPDDR5X·DDR5
iGPU HD 3000 1300MHz	iGPU Radeon 740M 2500MHz
Peak·FP32·FP16 249.6 GFLOPSFP32	Peak·FP32·FP16 2.56 TFLOPSFP16
Socket BGA 1224	Socket FP8

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Core i7-2760QM611

x1

Ryzen 3 PRO 2102,100

x3.44

Show Top Score

Core Config

4 Cores 4P -	4 Cores 1P 3E
8 Threads 8P -	8 Threads 2P 6E

Clocks

Base Clock 2.4GHz	Base Clock 3GHz
Boost Clock 3.5GHz	Boost Clock 4.7GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P	L1i 32KB P
L1d 32KB P	L1d 32KB P
L2 256KB P	L2 1MB P
L3 6MB	L3 8MB

Memory

Type DDR3	Type LPDDR5X·DDR5
Max Memory 32GB	Max Memory 256GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 1600MT/s	Speed 7500MT/s
Bandwidth 25.6GB/s	Bandwidth 120GB/s
Bandwidth Calculator Channels Transfer Rate1600MT/s Calculated Bandwidth 25.6GB/s	Bandwidth Calculator Channels Transfer Rate7500MT/s Calculated Bandwidth 120GB/s

Power & Thermals

TDP 45W	TDP 28W
cTDP-down -	cTDP-down 15W
cTDP-up -	cTDP-up 30W
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max

Chipset Bus

Bus Type DMI	Bus Type PCIe
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 5GT/s	Bus Speed 16GT/s
Bus Bandwidth 2.5GB/s	Bus Bandwidth 8GB/s

Expansion

PCIe PCIe 2.0 x16 8GB/sBandwidth

PCIe PCIe 4.0 x14 27.6GB/sBandwidth

iGPU

iGPU HD 3000 1300MHz	iGPU Radeon 740M 2500MHz
Shaders 96	Shaders 256
Boost Clock 1.3GHz	Boost Clock 2.5GHz
Peak·FP32·FP16 249.6 GFLOPSFP32	Peak·FP32·FP16 2.56 TFLOPSFP16

Chip

Manufacturer Intel	Manufacturer AMD
ISA x86-64	ISA x86-64
Architecture Sandy Bridge	Architecture Zen 4
Family Core 2nd Gen	Family Ryzen 200
Branding	Branding
Codename Gladden Sandy Bridge-HE-4Die Sandy Bridge-4C-GT2Variant - -	Codename Hawk Point - Hawk Point SVariant Zen 4P-Core Zen 4cE-Core
Market Segment Laptop	Market Segment Laptop
Release Date Sep 1, 2011	Release Date Jan 6, 2025

Fabrication

Foundry Intel	Foundry TSMC
Fabrication Node 32nm	Fabrication Node N4
Die Size 216mm²	Die Size 137mm²
Transistor Count 1.2 Billion	Transistor Count 20.9 Billion
Transistor Density 5 MTr/mm²	Transistor Density 153 MTr/mm²

Images

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Used In

Laptops MacBook Pro 15(Late 2011)MacBook Pro 17(Late 2011)

Laptops -

Competitors

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