Intel Core i7-4960HQ vs AMD Ryzen 3 PRO 210 Full Specs

Summary

4 Cores 8 Threads 2.6GHz	4 Cores(1P+3E) 8 Threads(2P+6E) 3GHz
TDP 47W	TDP 28W
Bandwidth 25.6GB/s DDR3L	Bandwidth 120GB/s LPDDR5X·DDR5
iGPU Iris Pro 5200 1300MHz	iGPU Radeon 740M 2500MHz
Peak·FP32·FP16 832 GFLOPSFP32	Peak·FP32·FP16 2.56 TFLOPSFP16
Socket BGA 1364	Socket FP8

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Core i7-4960HQ1,140

x1

Ryzen 3 PRO 2102,100

x1.84

Show Top Score

Core Config

4 Cores 4P -	4 Cores 1P 3E
8 Threads 8P -	8 Threads 2P 6E

Clocks

Base Clock 2.6GHz	Base Clock 3GHz
Boost Clock 3.8GHz	Boost Clock 4.7GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P	L1i 32KB P
L1d 32KB P	L1d 32KB P
L2 256KB P	L2 1MB P
L3 6MB	L3 8MB
L4 Cache 128MB	L4 Cache -

Memory

Type DDR3L	Type LPDDR5X·DDR5
Max Memory 32GB	Max Memory 256GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 1600MT/s	Speed 7500MT/s
Bandwidth 25.6GB/s	Bandwidth 120GB/s
Bandwidth Calculator Channels Transfer Rate1600MT/s Calculated Bandwidth 25.6GB/s	Bandwidth Calculator Channels Transfer Rate7500MT/s Calculated Bandwidth 120GB/s

Power & Thermals

TDP 47W	TDP 28W
cTDP-down -	cTDP-down 15W
cTDP-up -	cTDP-up 30W
Max Operating Temp -	Max Operating Temp 100°C Max

Chipset Bus

Bus Type DMI	Bus Type PCIe
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 5GT/s	Bus Speed 16GT/s
Bus Bandwidth 2.5GB/s	Bus Bandwidth 8GB/s

Expansion

PCIe PCIe 3.0 x16 15.8GB/sBandwidth

PCIe PCIe 4.0 x14 27.6GB/sBandwidth

iGPU

iGPU Iris Pro 5200 1300MHz	iGPU Radeon 740M 2500MHz
Shaders 320	Shaders 256
Boost Clock 1.3GHz	Boost Clock 2.5GHz
Peak·FP32·FP16 832 GFLOPSFP32	Peak·FP32·FP16 2.56 TFLOPSFP16

Chip

Manufacturer Intel	Manufacturer AMD
ISA x86-64	ISA x86-64
Architecture Haswell	Architecture Zen 4
Family Core 4th Gen	Family Ryzen 200
Branding	Branding
Codename Crystalwell - - -	Codename Hawk Point Hawk Point SVariant Zen 4P-Core Zen 4cE-Core
Market Segment Laptop	Market Segment Laptop
Release Date Sep 1, 2013	Release Date Jan 6, 2025

Fabrication

Foundry Intel	Foundry TSMC
Other Foundries InteleDRAM	Other Foundries -
Fabrication Node 22nm 22nmeDRAM	Fabrication Node N4 -
Die Size 260mm² 77mm²eDRAM	Die Size 137mm² -
Transistor Count 1.7 Billion	Transistor Count 20.9 Billion
Transistor Density 7 MTr/mm²	Transistor Density 153 MTr/mm²

Images

No images available

No images available

Used In

Laptops MacBook Pro 15(Late 2013)

Laptops -

Competitors

IntelCore i7-4960HQ vs CPU AMDRyzen 5 PRO 220 IntelCore i7-4960HQ vs CPU AMDRyzen 5 240 IntelCore i7-4960HQ vs CPU AMDRyzen 5 PRO 230 Show 12 more

AMDRyzen 3 PRO 210 vs CPU AMDRyzen 5 PRO 220 AMDRyzen 3 PRO 210 vs CPU AMDRyzen 5 240 AMDRyzen 3 PRO 210 vs CPU AMDRyzen 5 PRO 230 Show 12 more