Intel Core i7-860 vs AMD Ryzen 3 PRO 8300G Full Specs

Summary

4 Cores 8 Threads 2.8GHz	4 Cores(1P+3E) 8 Threads(2P+6E) 4GHz
TDP 95W	TDP 65W
Bandwidth 21.3GB/s DDR3	Bandwidth 83.2GB/s DDR5
iGPU -	iGPU Radeon 740M 2600MHz
Peak·FP32·FP16 -	Peak·FP32·FP16 2.66 TFLOPSFP16
Socket LGA 1156	Socket AM5

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi E-Core Boost Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Core i7-860511

x1

Ryzen 3 PRO 8300G2,340

x4.58

Show Top Score

Core Config

4 Cores 4P -	4 Cores 1P 3E
8 Threads 8P -	8 Threads 2P 6E

Clocks

Base Clock 2.8GHz	Base Clock 4GHz
Boost Clock 3.46GHz	Boost Clock 4.9GHz
Overclocking Locked	Overclocking Unlocked

Cache

L1i 32KB P	L1i 32KB P
L1d 32KB P	L1d 32KB P
L2 256KB P	L2 1MB P
L3 8MB	L3 8MB

Memory

Type DDR3	Type DDR5
Max Memory 16GB	Max Memory 256GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 1333MT/s	Speed 5200MT/s
Bandwidth 21.3GB/s	Bandwidth 83.2GB/s
Bandwidth Calculator Channels Transfer Rate1333MT/s Calculated Bandwidth 21.3GB/s	Bandwidth Calculator Channels Transfer Rate5200MT/s Calculated Bandwidth 83.2GB/s

Power & Thermals

TDP 95W	TDP 65W
cTDP-down -	cTDP-down 45W
Max Operating Temp -	Max Operating Temp 95°C Max
T-Case 72.7°C Max	T-Case -
Voltage Range -	Voltage Range -
Included Cooler 1	Included Cooler -

Chipset Bus

Bus Type DMI	Bus Type PCIe
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 2.5GT/s	Bus Speed 16GT/s
Bus Bandwidth 1.3GB/s	Bus Bandwidth 8GB/s

Expansion

PCIe PCIe 2.0 x16 8GB/sBandwidth

PCIe PCIe 4.0 x10 19.7GB/sBandwidth

iGPU

iGPU -	iGPU Radeon 740M 2600MHz
Shaders -	Shaders 256
Boost Clock -	Boost Clock 2.6GHz
Peak·FP32·FP16 -	Peak·FP32·FP16 2.66 TFLOPSFP16

Chip

Manufacturer Intel	Manufacturer AMD
ISA x86-64	ISA x86-64
Architecture Nehalem	Architecture Zen 4
Family Core 1st Gen	Family Ryzen 8000
Branding	Branding
Codename Lynnfield - -	Codename Phoenix 2 Zen 4P-Core Zen 4cE-Core
Market Segment Desktop	Market Segment Desktop
Release Date Sep 1, 2009	Release Date Apr 16, 2024

Fabrication

Foundry Intel	Foundry TSMC
Fabrication Node 45nm	Fabrication Node N4
Die Size 296mm²	Die Size 137mm²
Transistor Count 774 Million	Transistor Count 20.9 Billion
Transistor Density 3 MTr/mm²	Transistor Density 153 MTr/mm²

Images

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Used In

All-in-Ones iMac 27(Late 2009)

All-in-Ones -

Competitors

IntelCore i7-860 vs CPU AMDRyzen 3 5305G IntelCore i7-860 vs CPU AMDRyzen 5 9600X IntelCore i7-860 vs CPU AMDRyzen 3 5305GE Show 12 more

AMDRyzen 3 PRO 8300G vs CPU AMDRyzen 3 PRO 8300GE AMDRyzen 3 PRO 8300G vs CPU AMDRyzen 5 8400F AMDRyzen 3 PRO 8300G vs CPU AMDRyzen 5 9600X Show 12 more