Intel Core i9-14900HX vs Qualcomm Snapdragon X Plus (X1P-42-100) Full Specs

Summary

24 Cores(8P+16E) 32 Threads(16P+16E) 2.2GHz	8 Cores 8 Threads 3.2GHz
TDP 55W	TDP 23W
Bandwidth 89.6GB/s DDR5·DDR4	Bandwidth 135.2GB/s LPDDR5X
iGPU UHD 32EU 1650MHz Gen 12	iGPU Adreno X1 1.7T
Peak·FP32·FP16 1.69 TFLOPSFP16	Peak·FP32·FP16 3.41 TFLOPSFP16
Socket BGA 1964	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi E-Core Boost Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core i9-14900HX2,950

x1.29

Snapdragon X Plus (X1P-42-100)2,288

x1

Show Top Score

Core Config

24 Cores 8P 16E	8 Cores 8P -
32 Threads 16P 16E	8 Threads 8P -

Clocks

Base Clock 2.2GHz	Base Clock 3.2GHz
Boost Clock 5.8GHz	Boost Clock 3.4GHz
Overclocking Unlocked	Overclocking Locked

Cache

L1i 32KB P 64KB E	L1i 192KB P -
L1d 48KB P 32KB E	L1d 96KB P -
L2 2MB P - 16MB E shared	L2 24MB P shared -
L3 36MB	L3 -
SLC Cache -	SLC Cache 6MB

Memory

Type DDR5·DDR4	Type LPDDR5X
Max Memory 192GB	Max Memory 64GB
ECC No	ECC No
Channels 2	Channels 8
Bus Width 128-bit	Bus Width 128-bit
Speed 5600MT/s	Speed 8448MT/s
Bandwidth 89.6GB/s	Bandwidth 135.2GB/s
Bandwidth Calculator Channels Transfer Rate5600MT/s Calculated Bandwidth 89.6GB/s	Bandwidth Calculator Channels Transfer Rate8448MT/s Calculated Bandwidth 135.2GB/s

Power & Thermals

TDP 55W	TDP 23W
cTDP-down 45W	cTDP-down -
Peak Power 157W	Peak Power -
Max Operating Temp 100°C Max	Max Operating Temp -

Chipset Bus

Bus Type DMI	Bus Type -
Bus Config 8 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 16GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 5.0 x16 63GB/sBandwidth	PCIe PCIe 4.0 x12 23.6GB/sBandwidth
PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth	PCIe Secondary PCIe 3.0 x4 3.9GB/sBandwidth

iGPU

iGPU UHD 32EU 1650MHz Gen 12	iGPU Adreno X1 1.7T
Shaders 256	Shaders 1024
Boost Clock 1.65GHz	Boost Clock 833MHz
Peak·FP32·FP16 1.69 TFLOPSFP16	Peak·FP32·FP16 3.41 TFLOPSFP16

NPU

NPU Model GNA 3.0	NPU Model Hexagon
Performance -	Performance 45 TOPSINT8

Chip

Manufacturer Intel	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Raptor Lake	Architecture OryonARMv8.7-A
Family Core 14th Gen	Family X Series
Branding	Branding
Codename Raptor Lake-HX Raptor Lake-8P-16EVariant Raptor CoveP-Core GracemontE-Core	Codename Hamoa Snapdragon X EliteVariant PhoenixP-Core -
Market Segment Laptop	Market Segment Laptop
Release Date Jan 8, 2024	Release Date Sep 4, 2024

Fabrication

Foundry Intel	Foundry TSMC
Fabrication Node Intel 7	Fabrication Node N4P
Die Size 257mm²	Die Size 170mm²
Transistor Count 18.5 Billion	Transistor Count -
Transistor Density 72 MTr/mm²	Transistor Density -

Images

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Used In

Laptops Blade 18(Early 2024)Alienware m18(R2, Early 2024)Blade 16(Early 2024)

Laptops XPS 13(9345, Mid 2024)Inspiron 14(5441, Late 2024)

Competitors

IntelCore i9-14900HX vs CPU IntelCore Ultra 9 275HX IntelCore i9-14900HX vs CPU IntelCore Ultra 9 285HX IntelCore i9-14900HX vs CPU IntelCore Ultra 7 265HX Show 12 more

QualcommSnapdragon X Plus (X1P-42-100) vs CPU AMDRyzen AI 7 PRO 350 QualcommSnapdragon X Plus (X1P-42-100) vs CPU AMDRyzen AI 7 350 QualcommSnapdragon X Plus (X1P-42-100) vs CPU AMDRyzen 7 250 Show 12 more