CPUs

Intel Core m3-6Y30 vs AMD A8-4555M Full Specs

2 Cores
4 Threads
900MHz
2 Cores
4 Threads
1.6GHz
TDP
4.5W
TDP
19W
Bandwidth
29.9GB/s
·
Bandwidth
21.3GB/s
DDR3
iGPU
iGPU
··
326.4 GFLOPSFP32
··
325.6 GFLOPSFP32
Socket
Socket

2 Cores
2 Cores
4 Threads
4 Threads

Base Clock
900MHz
Base Clock
1.6GHz
Boost Clock
2.2GHz
Boost Clock
2.4GHz
Overclocking
Locked
Overclocking
Locked

L1i
32KB
L1i
64KB
L1d
32KB
L1d
16KB
L2
256KB
L2
2MB
L3
4MB
L3
-

Type
·
Type
DDR3
Max Memory
16GB
Max Memory
32GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
128-bit
Bus Width
128-bit
Speed
1866MT/s
Speed
1333MT/s
Bandwidth
29.9GB/s
Bandwidth
21.3GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
29.9GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
21.3GB/s

TDP
4.5W
TDP
19W
cTDP-down
4W
cTDP-down
-
Max Operating Temp
100°C Max
Max Operating Temp
-
Included Cooler
0
Included Cooler
-

Bus Type
OPI
Bus Type
UMI
Bus Config
4 lanes
Bus Config
4 lanes
Bus Speed
4GT/s
Bus Speed
4GT/s
Bus Bandwidth
2GB/s
Bus Bandwidth
2GB/s

PCIe
PCIe 3.0 x10
9.8GB/sBandwidth
PCIe
PCIe 2.0 x20
10GB/sBandwidth

iGPU
iGPU
Shaders
192
Shaders
384
Boost Clock
850MHz
Boost Clock
424MHz
··
326.4 GFLOPSFP32
··
325.6 GFLOPSFP32

Controller Model
100 Series Y+
Controller Model
-
Codename
Skylake
Codename
-
PCIe
-
PCIe
-

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Core m3 2015 branding
Branding
A8 2011 branding
Codename
Skylake-H
-
Skylake-2C-GT2Variant
Codename
Trinity
VirgoDie
-
Market Segment
Laptop
Market Segment
Laptop
Release Date
Sep 1, 2015
Release Date
Sep 27, 2012

Foundry
Intel
Foundry
GlobalFoundries
Other Foundries
IntelPCH
Other Foundries
-
Fabrication Node
14nm
22nmPCH
Fabrication Node
32nm
-
Die Size
102mm²
50mm²PCH
Die Size
246mm²
-
Transistor Count
1.8 Billion
Transistor Count
1.3 Billion
Transistor Density
17 MTr/mm²
Transistor Density
5 MTr/mm²