Intel Core m3-6Y30 vs Qualcomm Snapdragon 865+ Full Specs

Summary

2 Cores 4 Threads 900MHz	8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 3.1GHz
TDP 4.5W	TDP 5W
Bandwidth 29.9GB/s LPDDR3·DDR3L	Bandwidth 44GB/s LPDDR5·LPDDR4X
iGPU HD 515 850MHz	iGPU Adreno 650+
Peak·FP32·FP16 326.4 GFLOPSFP32	Peak·FP32·FP16 2.06 TFLOPSFP16
Socket BGA 1515	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core m3-6Y30710

x1

Snapdragon 865+1,134

x1.60

Show Top Score

Core Config

2 Cores 2P - -	8 Cores 1P 3M 4E
4 Threads 4P - -	8 Threads 1P 3M 4E

Clocks

Base Clock 900MHz	Base Clock 3.1GHz
Boost Clock 2.2GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P - -	L1i 64KB P 64KB M 32KB E
L1d 32KB P - -	L1d 64KB P 64KB M 32KB E
L2 256KB P - -	L2 512KB P 256KB M 128KB E
L3 4MB	L3 4MB
SLC Cache -	SLC Cache 3MB

Memory

Type LPDDR3·DDR3L	Type LPDDR5·LPDDR4X
Max Memory 16GB	Max Memory 24GB
ECC No	ECC No
Channels 2	Channels 4
Bus Width 128-bit	Bus Width 64-bit
Speed 1866MT/s	Speed 5500MT/s
Bandwidth 29.9GB/s	Bandwidth 44GB/s
Bandwidth Calculator Channels Transfer Rate1866MT/s Calculated Bandwidth 29.9GB/s	Bandwidth Calculator Channels Transfer Rate5500MT/s Calculated Bandwidth 44GB/s

Power & Thermals

TDP 4.5W	TDP 5W
cTDP-down 4W	cTDP-down -
Max Operating Temp 100°C Max	Max Operating Temp -
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type OPI	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 4GT/s	Bus Speed -
Bus Bandwidth 2GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 3.0 x10 9.8GB/sBandwidth

-

iGPU

iGPU HD 515 850MHz	iGPU Adreno 650+
Shaders 192	Shaders 768
Boost Clock 850MHz	Boost Clock 670MHz
Peak·FP32·FP16 326.4 GFLOPSFP32	Peak·FP32·FP16 2.06 TFLOPSFP16

NPU

NPU Model -	NPU Model Hexagon 698
NPU Clock -	NPU Clock 576MHz
Performance -	Performance 15 TOPS

Cellular

Modem Model -	Modem Model X55
Cellular -	Cellular 5G mmWave
Peak Down -	Peak Down Up to 7.5Gbps
Peak Up -	Peak Up Up to 3.0Gbps

Controller

Controller Model 100 Series Y+	Controller Model -
Codename Skylake	Codename -
PCIe -	PCIe -

Chip

Manufacturer Intel	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Skylake	Architecture Kryo 585ARMv8.2-A
Family Core 6th Gen	Family 8 Series
Branding	Branding
Codename Skylake-H Skylake-2C-GT2Variant - - -	Codename - - Cortex-A77P-Core Cortex-A77M-Core Cortex-A55E-Core
Market Segment Laptop	Market Segment Smartphone
Release Date Sep 1, 2015	Release Date Aug 30, 2020

Fabrication

Foundry Intel	Foundry TSMC
Other Foundries IntelPCH	Other Foundries -
Fabrication Node 14nm 22nmPCH	Fabrication Node N7P -
Die Size 102mm² 50mm²PCH	Die Size 84mm² -
Transistor Count 1.8 Billion	Transistor Count 10.3 Billion
Transistor Density 17 MTr/mm²	Transistor Density 123 MTr/mm²

Images

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Used In

Tablets Surface Pro 4(Intel 6th Gen, Late 2015)

Tablets Galaxy Tab S7(SD 865+, Mid 2020)Galaxy Tab S7+(SD 865+, Mid 2020)

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