Intel Core Ultra 5 225U vs Qualcomm Snapdragon X Plus (X1P-64-100) Full Specs

Summary

12 Cores(2P+8M+2E) 14 Threads(4P+8M+2E) 1.5GHz	10 Cores 10 Threads 3.4GHz
TDP 15W	TDP 23W
Bandwidth 134.4GB/s LPDDR5X·DDR5	Bandwidth 135.2GB/s LPDDR5X
iGPU Graphics 4C 2000MHz	iGPU Adreno X1 3.8T
Peak·FP32·FP16 4.1 TFLOPSFP16	Peak·FP32·FP16 7.68 TFLOPSFP16
Socket BGA 2049	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi E-Core Boost Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core Ultra 5 225U-

-

Snapdragon X Plus (X1P-64-100)2,349

x1

Show Top Score

Core Config

12 Cores 2P 8M 2E	10 Cores 10P - -
14 Threads 4P 8M 2E	10 Threads 10P - -

Clocks

Base Clock 1.5GHz	Base Clock 3.4GHz
Boost Clock 4.8GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P 64KB M 64KB E	L1i 192KB P - -
L1d 48KB P 32KB M 32KB E	L1d 96KB P - -
L2 3MB P - 8MB M shared 8MB E shared	L2 36MB P shared - -
L3 12MB	L3 -
SLC Cache -	SLC Cache 6MB

Memory

Type LPDDR5X·DDR5	Type LPDDR5X
Max Memory 96GB	Max Memory 64GB
ECC No	ECC No
Channels 2	Channels 8
Bus Width 128-bit	Bus Width 128-bit
Speed 8400MT/s	Speed 8448MT/s
Bandwidth 134.4GB/s	Bandwidth 135.2GB/s
Bandwidth Calculator Channels Transfer Rate8400MT/s Calculated Bandwidth 134.4GB/s	Bandwidth Calculator Channels Transfer Rate8448MT/s Calculated Bandwidth 135.2GB/s

Power & Thermals

TDP 15W	TDP 23W
cTDP-down 12W	cTDP-down -
Peak Power 57W	Peak Power -
Max Operating Temp 110°C Max	Max Operating Temp -

Expansion

PCIe PCIe 4.0 x20 39.4GB/sBandwidth	PCIe PCIe 4.0 x12 23.6GB/sBandwidth
-	PCIe Secondary PCIe 3.0 x4 3.9GB/sBandwidth

iGPU

iGPU Graphics 4C 2000MHz	iGPU Adreno X1 3.8T
Shaders 512	Shaders 1536
Boost Clock 2GHz	Boost Clock 1.25GHz
Peak·FP32·FP16 4.1 TFLOPSFP16	Peak·FP32·FP16 7.68 TFLOPSFP16

NPU

NPU Model AI Boost 3	NPU Model Hexagon
NPU Cores 2	NPU Cores -
Performance 13 TOPSINT8	Performance 45 TOPSINT8

Chip

Manufacturer Intel	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Arrow Lake	Architecture OryonARMv8.7-A
Family Core Ultra Series 2	Family X Series
Branding	Branding
Codename Arrow Lake-U Arrow Lake-U-2P-8EVariant Redwood CoveP-Core CrestmontM-Core CrestmontE-Core	Codename Hamoa Snapdragon X EliteVariant PhoenixP-Core - -
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Apr 24, 2024

Fabrication

Foundry Intel	Foundry TSMC
Other Foundries TSMCiGPU TSMCIO TSMCSoC	Other Foundries -
Fabrication Node Intel 3 N5iGPU N6IO N6SoC	Fabrication Node N4P - - -
Die Size - 23mm²iGPU 10mm²IO 100mm²SoC	Die Size 170mm² - - -

Images

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Used In

Laptops -	Laptops XPS 13(9345, Mid 2024)Inspiron 14(5441, Late 2024)Inspiron 14 Plus(7441, Late 2024) Show 2 more
Tablets -	Tablets Surface Pro 11(X Elite, Mid 2024)

Competitors

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QualcommSnapdragon X Plus (X1P-64-100) vs CPU QualcommSnapdragon X2 Elite (X2E-80-100) QualcommSnapdragon X Plus (X1P-64-100) vs CPU AMDRyzen 7 260 QualcommSnapdragon X Plus (X1P-64-100) vs CPU IntelCore Ultra 5 235U Show 12 more