Qualcomm Snapdragon X Plus (X1P-64-100) vs AMD Ryzen 7 260 Full Specs

Summary

10 Cores 10 Threads 3.4GHz	8 Cores 16 Threads 3.8GHz
TDP 23W	TDP 45W
Bandwidth 135.2GB/s LPDDR5X	Bandwidth 120GB/s LPDDR5X·DDR5
iGPU Adreno X1 3.8T	iGPU Radeon 780M 2700MHz
Peak·FP32·FP16 7.68 TFLOPSFP16	Peak·FP32·FP16 8.29 TFLOPSFP16
Socket -	Socket FP8

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon X Plus (X1P-64-100)2,349

x1

Ryzen 7 2602,371

x1.01

Show Top Score

Core Config

10 Cores	8 Cores
10 Threads	16 Threads

Clocks

Base Clock 3.4GHz	Base Clock 3.8GHz
Boost Clock -	Boost Clock 5.1GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB	L1i 32KB
L1d 96KB	L1d 32KB
L2 36MB shared	L2 1MB
L3 -	L3 16MB
SLC Cache 6MB	SLC Cache -

Memory

Type LPDDR5X	Type LPDDR5X·DDR5
Max Memory 64GB	Max Memory 256GB
ECC No	ECC No
Channels 8	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 8448MT/s	Speed 7500MT/s
Bandwidth 135.2GB/s	Bandwidth 120GB/s
Bandwidth Calculator Channels Transfer Rate8448MT/s Calculated Bandwidth 135.2GB/s	Bandwidth Calculator Channels Transfer Rate7500MT/s Calculated Bandwidth 120GB/s

Power & Thermals

TDP 23W	TDP 45W
cTDP-down -	cTDP-down 35W
cTDP-up -	cTDP-up 54W
Max Operating Temp -	Max Operating Temp 100°C Max

Chipset Bus

Bus Type -	Bus Type PCIe
Bus Config -	Bus Config 4 lanes
Bus Speed -	Bus Speed 16GT/s
Bus Bandwidth -	Bus Bandwidth 8GB/s

Expansion

PCIe PCIe 4.0 x12 23.6GB/sBandwidth	PCIe PCIe 4.0 x20 39.4GB/sBandwidth
PCIe Secondary PCIe 3.0 x4 3.9GB/sBandwidth	-

iGPU

iGPU Adreno X1 3.8T	iGPU Radeon 780M 2700MHz
Shaders 1536	Shaders 768
Boost Clock 1.25GHz	Boost Clock 2.7GHz
Peak·FP32·FP16 7.68 TFLOPSFP16	Peak·FP32·FP16 8.29 TFLOPSFP16

NPU

NPU Model Hexagon	NPU Model XDNA
Performance 45 TOPSINT8	Performance 16 TOPSINT4

Chip

Manufacturer Qualcomm	Manufacturer AMD
ISA AArch64	ISA x86-64
Architecture OryonARMv8.7-A	Architecture Zen 4
Family X Series	Family Ryzen 200
Branding	Branding
Codename Hamoa Snapdragon X EliteVariant PhoenixP-Core	Codename Hawk Point - -
Market Segment Laptop	Market Segment Laptop
Release Date Apr 24, 2024	Release Date Jan 6, 2025

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N4P	Fabrication Node N4
Die Size 170mm²	Die Size 178mm²
Transistor Count -	Transistor Count 25 Billion
Transistor Density -	Transistor Density 140 MTr/mm²

Images

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Used In

Laptops XPS 13(9345, Mid 2024)Inspiron 14(5441, Late 2024)Inspiron 14 Plus(7441, Late 2024) Show 2 more	Laptops -
Tablets Surface Pro 11(X Elite, Mid 2024)	Tablets -

Competitors

QualcommSnapdragon X Plus (X1P-64-100) vs CPU QualcommSnapdragon X2 Elite (X2E-80-100) QualcommSnapdragon X Plus (X1P-64-100) vs CPU AMDRyzen AI 7 PRO 350 QualcommSnapdragon X Plus (X1P-64-100) vs CPU AMDRyzen 9 270 Show 12 more

AMDRyzen 7 260 vs CPU AMDRyzen 9 270 AMDRyzen 7 260 vs CPU AMDRyzen 7 250 AMDRyzen 7 260 vs CPU AMDRyzen 7 PRO 250 Show 12 more