Intel Core Ultra 9 285K vs NVIDIA Grace Blackwell GB10 Full Specs

Summary

24 Cores(8P+16E) 24 Threads(8P+16E) 3.7GHz	20 Cores(10P+10E) 20 Threads(10P+10E) 3GHz
TDP 125W	TDP 150W
Bandwidth 102.4GB/s DDR5	Bandwidth 273.1GB/s LPDDR5X
iGPU Graphics 4C 2000MHz	iGPU GB10
Peak·FP32·FP16 4.1 TFLOPSFP16	Peak·FP32·FP16 992.9 TFLOPSFP16
Socket LGA 1851	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi E-Core Boost Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core Ultra 9 285K3,379

x1

Grace Blackwell GB10-

-

Show Top Score

Core Config

24 Cores 8P 16E	20 Cores 10P 10E
24 Threads 8P 16E	20 Threads 10P 10E

Clocks

Base Clock 3.7GHz	Base Clock 3GHz
Boost Clock 5.7GHz	Boost Clock -
Overclocking Unlocked	Overclocking Locked

Cache

L1i 64KB P 64KB E	L1i 64KB P -
L1d 48KB P 32KB E	L1d 64KB P -
L2 3MB P 16MB E shared	L2 1MB P -
L3 36MB	L3 -

Memory

Type DDR5	Type LPDDR5X
Max Memory 192GB	Max Memory 128GB
ECC Yes	ECC No
Channels 2	Channels 4
Bus Width 128-bit	Bus Width 256-bit
Speed 6400MT/s	Speed 8533MT/s
Bandwidth 102.4GB/s	Bandwidth 273.1GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 102.4GB/s	Bandwidth Calculator Channels Transfer Rate8533MT/s Calculated Bandwidth 273.1GB/s

Power & Thermals

TDP 125W	TDP 150W
Peak Power 250W	Peak Power -
Max Operating Temp 105°C Max	Max Operating Temp -
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type DMI	Bus Type -
Bus Config 8 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 16GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 5.0 x20 78.8GB/sBandwidth	-
PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth	-

iGPU

iGPU Graphics 4C 2000MHz	iGPU GB10
Shaders 512	Shaders 6144
Boost Clock 2GHz	Boost Clock 2.52GHz
Peak·FP32·FP16 4.1 TFLOPSFP16	Peak·FP32·FP16 992.9 TFLOPSFP16

NPU

NPU Model AI Boost 3	NPU Model -
NPU Cores 2	NPU Cores -
Performance 13 TOPSINT8	Performance -

Chip

Manufacturer Intel	Manufacturer NVIDIA
ISA x86-64	ISA AArch64
Architecture Arrow Lake	Architecture ARMv9.2-A
Family Core Ultra Series 2	Family -
Branding	Branding
Codename Arrow Lake-S - Arrow Lake-S-8P-16EVariant Lion CoveP-Core SkymontE-Core	Codename Grace Blackwell GB10Die Grace Blackwell GB10Variant Cortex-X925P-Core Cortex-A725E-Core
Market Segment Desktop	Market Segment Embedded
Release Date Oct 24, 2024	Release Date Jan 6, 2025

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries TSMCiGPU TSMCIO TSMCSoC	Other Foundries -
Fabrication Node N3B N5iGPU N6IO N6SoC	Fabrication Node N3E - - -
Die Size 135mm² 23mm²iGPU 28mm²IO 100mm²SoC	Die Size -

Images

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Used In

Desktops OMEN 35L(Late 2024)OMEN 45L(Late 2024)

Desktops DGX Spark(Late 2025)

Competitors

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