Intel Pentium Gold 4425Y vs Qualcomm Snapdragon 8 Gen 1 Full Specs
2 Cores 4 Threads 1.7GHz | 8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 3GHz |
TDP 6W | TDP 5W |
Bandwidth 29.9GB/s · | Bandwidth 51.2GB/s LPDDR5 |
iGPU | iGPU |
·· 326.4 GFLOPSFP16 | ·· 3.35 TFLOPSFP16 |
Socket | Socket - |
Pentium Gold 4425Y425
Snapdragon 8 Gen 11,3112 Cores 2P - - | 8 Cores 1P 3M 4E |
4 Threads 4P - - | 8 Threads 1P 3M 4E |
Base Clock 1.7GHz | Base Clock 3GHz |
Overclocking Locked | Overclocking Locked |
L1i 32KB P - - | L1i 64KB P 64KB M 32KB E |
L1d 32KB P - - | L1d 64KB P 64KB M 32KB E |
L2 256KB P - - | L2 1MB P 512KB M 128KB E |
L3 2MB | L3 6MB |
SLC Cache - | SLC Cache 4MB |
Type · | Type LPDDR5 |
Max Memory 16GB | Max Memory 24GB |
ECC No | ECC No |
Channels 2 | Channels 4 |
Bus Width 128-bit | Bus Width 64-bit |
Speed 1866MT/s | Speed 6400MT/s |
Bandwidth 29.9GB/s | Bandwidth 51.2GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 29.9GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 51.2GB/s |
TDP 6W | TDP 5W |
cTDP-down 5W | cTDP-down - |
Max Operating Temp 100°C Max | Max Operating Temp - |
Bus Type OPI | Bus Type - |
Bus Config 4 lanes | Bus Config - |
Bus Speed 4GT/s | Bus Speed - |
Bus Bandwidth 2GB/s | Bus Bandwidth - |
PCIe PCIe 3.0 x109.8GB/sBandwidth | - |
iGPU | iGPU |
Shaders 192 | Shaders 1024 |
Boost Clock 850MHz | Boost Clock 818MHz |
·· 326.4 GFLOPSFP16 | ·· 3.35 TFLOPSFP16 |
NPU Model - | NPU Model Hexagon |
Performance - | Performance 52 TOPSINT4 |
Modem Model - | Modem Model X65 |
Cellular - | Cellular 5G mmWave |
Peak Down - | Peak Down Up to 10.0Gbps |
Peak Up - | Peak Up Up to 3.0Gbps |
Controller Model 300 Series Y+ | Controller Model - |
Codename Amber Lake | Codename - |
PCIe - | PCIe - |
Manufacturer | Manufacturer |
ISA x86-64 | ISA AArch64 |
Architecture | Architecture KryoARMv9.0-A |
Family | Family |
Branding  | Branding  |
Codename Amber Lake-Y Amber Lake-2CVariant - - - | Codename - Snapdragon 8 Gen 1Variant Cortex-X2P-Core Cortex-A710M-Core Cortex-A510E-Core |
Market Segment Laptop | Market Segment Smartphone |
Release Date Jan 7, 2018 | Release Date Oct 5, 2021 |
Foundry Intel | Foundry Samsung |
Other Foundries IntelPCH | Other Foundries - |
Fabrication Node 14nm++ 22nmPCH | Fabrication Node 4LPE - |
Die Size 103mm² 52mm²PCH | Die Size 129mm² - |
Transistor Count 1.8 Billion | Transistor Count - |
Transistor Density 17 MTr/mm² | Transistor Density - |
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