CPUs

Intel Pentium II Xeon 400 vs AMD Ryzen 3 PRO 8300GE Full Specs

1 Cores
1 Threads
400MHz
4 Cores(1P+3E)
8 Threads(2P+6E)
3.5GHz
TDP
30.8W
TDP
35W
Bandwidth
-
Bandwidth
83.2GB/s
DDR5
iGPU
-
iGPU
··
-
··
2.66 TFLOPSFP16
Socket
Socket

Pentium II Xeon 400Pentium II Xeon 400-
-
Ryzen 3 PRO 8300GERyzen 3 PRO 8300GE2,250
x1

1 Cores
1P
-
4 Cores
1P
3E
1 Threads
1P
-
8 Threads
2P
6E

Base Clock
400MHz
Base Clock
3.5GHz
Boost Clock
-
Boost Clock
4.9GHz
Overclocking
Locked
Overclocking
Unlocked

L1i
16KB P
L1i
32KB P
L1d
16KB P
L1d
32KB P
L2
512KB P
L2
1MB P
L3
-
L3
8MB

Type
-
Type
DDR5
Max Memory
-
Max Memory
256GB
ECC
-
ECC
No
Channels
-
Channels
2
Bus Width
-
Bus Width
128-bit
Speed
-
Speed
5200MT/s
Bandwidth
-
Bandwidth
83.2GB/s
Bandwidth Calculator
-
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
83.2GB/s

TDP
30.8W
TDP
35W
Max Operating Temp
-
Max Operating Temp
95°C Max
Voltage Range
-
Voltage Range
-

Bus Type
FSB
Bus Type
PCIe
Bus Config
64-bit
Bus Config
4 lanes
Bus Speed
100MT/s
Bus Speed
16GT/s
Bus Bandwidth
0.8GB/s
Bus Bandwidth
8GB/s

-
PCIe
PCIe 4.0 x10
19.7GB/sBandwidth

iGPU
-
iGPU
Shaders
-
Shaders
256
Boost Clock
-
Boost Clock
2.6GHz
··
-
··
2.66 TFLOPSFP16

Manufacturer
Manufacturer
ISA
x86-32
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Pentium II Xeon 1998 branding
Branding
Ryzen 3 2024 branding
Codename
Drake
-
-
Codename
Phoenix 2
Zen 4P-Core
Zen 4cE-Core
Market Segment
Desktop
Market Segment
Desktop
Release Date
Jun 1, 1998
Release Date
Apr 16, 2024

Foundry
Intel
Foundry
TSMC
Other Foundries
IntelL2 Cahce
Other Foundries
-
Fabrication Node
250nm
350nmL2 Cahce
Fabrication Node
N4
-
Die Size
118mm²
222mm²L2 Cahce
Die Size
137mm²
-
Transistor Count
7.5 Million
25 MillionL2 Cahce
Transistor Count
20.9 Billion
-
Transistor Density
-
Transistor Density
153 MTr/mm²

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