Intel Pentium Silver N6000 vs Qualcomm Snapdragon 8 Gen 1 Full Specs

Summary

4 Cores 4 Threads 1.1GHz	8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 3GHz
TDP 6W	TDP 5W
Bandwidth 46.9GB/s LPDDR4X·DDR4	Bandwidth 51.2GB/s LPDDR5
iGPU UHD 32EU 850MHz Gen 11	iGPU Adreno 730
Peak·FP32·FP16 870.4 GFLOPSFP16	Peak·FP32·FP16 3.35 TFLOPSFP16
Socket BGA 1338	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Pentium Silver N6000520

x1

Snapdragon 8 Gen 11,311

x2.52

Show Top Score

Core Config

4 Cores 4P - -	8 Cores 1P 3M 4E
4 Threads 4P - -	8 Threads 1P 3M 4E

Clocks

Base Clock 1.1GHz	Base Clock 3GHz
Boost Clock 3.3GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P - -	L1i 64KB P 64KB M 32KB E
L1d 32KB P - -	L1d 64KB P 64KB M 32KB E
L2 1.5MB P shared	L2 1MB P 512KB M 128KB E -
L3 4MB	L3 6MB
SLC Cache -	SLC Cache 4MB

Memory

Type LPDDR4X·DDR4	Type LPDDR5
Max Memory 16GB	Max Memory 24GB
ECC No	ECC No
Channels 2	Channels 4
Bus Width 128-bit	Bus Width 64-bit
Speed 2933MT/s	Speed 6400MT/s
Bandwidth 46.9GB/s	Bandwidth 51.2GB/s
Bandwidth Calculator Channels Transfer Rate2933MT/s Calculated Bandwidth 46.9GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 51.2GB/s

Power & Thermals

TDP 6W	TDP 5W
cTDP-down 5W	cTDP-down -
Max Operating Temp 100°C Max	Max Operating Temp -

Expansion

PCIe PCIe 3.0 x8 7.9GB/sBandwidth

-

iGPU

iGPU UHD 32EU 850MHz Gen 11	iGPU Adreno 730
Shaders 256	Shaders 1024
Boost Clock 850MHz	Boost Clock 818MHz
Peak·FP32·FP16 870.4 GFLOPSFP16	Peak·FP32·FP16 3.35 TFLOPSFP16

NPU

NPU Model -	NPU Model Hexagon
Performance -	Performance 52 TOPSINT4

Cellular

Modem Model -	Modem Model X65
Cellular -	Cellular 5G mmWave
Peak Down -	Peak Down Up to 10.0Gbps
Peak Up -	Peak Up Up to 3.0Gbps

Chip

Manufacturer Intel	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Tremont	Architecture KryoARMv9.0-A
Family Pentium	Family 8 Series
Branding	Branding
Codename Jasper Lake - - - -	Codename - Snapdragon 8 Gen 1Variant Cortex-X2P-Core Cortex-A710M-Core Cortex-A510E-Core
Market Segment Laptop	Market Segment Smartphone
Release Date Jan 1, 2021	Release Date Oct 5, 2021

Fabrication

Foundry Intel	Foundry Samsung
Fabrication Node 10nm+	Fabrication Node 4LPE
Die Size -	Die Size 129mm²

Images

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Used In

Smartphones -	Smartphones Galaxy S23 FEGalaxy S22Galaxy S22+ Show 2 more
Tablets HP Tablet 11-be0097nr(Pentium Silver, Mid 2022)	Tablets Galaxy Tab S8(SD 8G1, Early 2022)Galaxy Tab S8+(SD 8G1, Early 2022)Galaxy Tab S8 Ultra(SD 8G1, Early 2022)

Competitors

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