Intel Pentium Silver N6000 vs Qualcomm Snapdragon 865+ Full Specs

Summary

4 Cores 4 Threads 1.1GHz	8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 3.1GHz
TDP 6W	TDP 5W
Bandwidth 46.9GB/s LPDDR4X·DDR4	Bandwidth 44GB/s LPDDR5·LPDDR4X
iGPU UHD 32EU 850MHz Gen 11	iGPU Adreno 650+
Peak·FP32·FP16 870.4 GFLOPSFP16	Peak·FP32·FP16 2.06 TFLOPSFP16
Socket BGA 1338	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Pentium Silver N6000520

x1

Snapdragon 865+1,134

x2.18

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Core Config

4 Cores 4P - -	8 Cores 1P 3M 4E
4 Threads 4P - -	8 Threads 1P 3M 4E

Clocks

Base Clock 1.1GHz	Base Clock 3.1GHz
Boost Clock 3.3GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P - -	L1i 64KB P 64KB M 32KB E
L1d 32KB P - -	L1d 64KB P 64KB M 32KB E
L2 1.5MB P shared	L2 512KB P 256KB M 128KB E -
L3 4MB	L3 4MB
SLC Cache -	SLC Cache 3MB

Memory

Type LPDDR4X·DDR4	Type LPDDR5·LPDDR4X
Max Memory 16GB	Max Memory 24GB
ECC No	ECC No
Channels 2	Channels 4
Bus Width 128-bit	Bus Width 64-bit
Speed 2933MT/s	Speed 5500MT/s
Bandwidth 46.9GB/s	Bandwidth 44GB/s
Bandwidth Calculator Channels Transfer Rate2933MT/s Calculated Bandwidth 46.9GB/s	Bandwidth Calculator Channels Transfer Rate5500MT/s Calculated Bandwidth 44GB/s

Power & Thermals

TDP 6W	TDP 5W
cTDP-down 5W	cTDP-down -
Max Operating Temp 100°C Max	Max Operating Temp -

Expansion

PCIe PCIe 3.0 x8 7.9GB/sBandwidth

-

iGPU

iGPU UHD 32EU 850MHz Gen 11	iGPU Adreno 650+
Shaders 256	Shaders 768
Boost Clock 850MHz	Boost Clock 670MHz
Peak·FP32·FP16 870.4 GFLOPSFP16	Peak·FP32·FP16 2.06 TFLOPSFP16

NPU

NPU Model -	NPU Model Hexagon 698
NPU Clock -	NPU Clock 576MHz
Performance -	Performance 15 TOPS

Cellular

Modem Model -	Modem Model X55
Cellular -	Cellular 5G mmWave
Peak Down -	Peak Down Up to 7.5Gbps
Peak Up -	Peak Up Up to 3.0Gbps

Chip

Manufacturer Intel	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Tremont	Architecture Kryo 585ARMv8.2-A
Family Pentium	Family 8 Series
Branding	Branding
Codename Jasper Lake - - -	Codename - Cortex-A77P-Core Cortex-A77M-Core Cortex-A55E-Core
Market Segment Laptop	Market Segment Smartphone
Release Date Jan 1, 2021	Release Date Aug 30, 2020

Fabrication

Foundry Intel	Foundry TSMC
Fabrication Node 10nm+	Fabrication Node N7P
Die Size -	Die Size 84mm²
Transistor Count -	Transistor Count 10.3 Billion
Transistor Density -	Transistor Density 123 MTr/mm²

Images

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Used In

Tablets HP Tablet 11-be0097nr(Pentium Silver, Mid 2022)

Tablets Galaxy Tab S7(SD 865+, Mid 2020)Galaxy Tab S7+(SD 865+, Mid 2020)

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