Qualcomm Adreno 618 vs Intel Graphics 4C 2300MHz Full Specs

Summary

256 Shaders 825MHz	512 Shaders 2.3GHz
Shared Memory25.6GB/s LPDDR5·LPDDR4X	Shared Memory136.5GB/s LPDDR5X·DDR5
Peak·FP32·FP16 422.4 GFLOPS	Peak·FP32·FP16 2.35 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP 5W	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Adreno 618844.8 GFLOPSFP16

x1

Graphics 4C 2300MHz75.37 TOPSINT4 Tensor

x89.21

Show Top Score

Theoretical Performance

Clock Speed825MHz UC·Base·Boost·OC	Clock Speed2300MHz UC·Boost·OC
Peak OPS 844.8 GFLOPSFP16	Peak OPS 75.37 TOPSINT4 Tensor
-	Tensor FP16-32 18.84 TFLOPS
-	Tensor BF16 18.84 TFLOPS
FP32 422.4 GFLOPS	FP32 2.35 TFLOPS
FP64 105.6 GFLOPS	FP64 588.8 GFLOPS
Tensor INT4 -	Tensor INT4 75.37 TOPS
-	Tensor INT8 37.68 TOPS
Pixel Rate 6.6 GPixel/s	Pixel Rate 36.8 GPixel/s
Texture Rate 13.2 GTexel/s	Texture Rate 73.6 GTexel/s

Core Config

Shaders 256 Shaders	Shaders 512 Shaders
TMUs 16 TMUs	TMUs 32 TMUs
ROPs 8 ROPs	ROPs 16 ROPs
Tensor Cores -	Tensor Cores 32 T-Cores
RT Cores -	RT Cores 4 RT-Cores
EUs 2 EUs	EUs 32 EUs

Clocks

Base Clock 700MHz	Base Clock -
Boost Clock 825MHz	Boost Clock 2.3GHz

Cache

L2 Cache -

L2 Cache 4.1MB shared

Memory

Shared Memory LPDDR5·LPDDR4X	Shared Memory LPDDR5X·DDR5
Memory Bus 32-bit	Memory Bus 128-bit
Memory Speed 6.4GT/s	Memory Speed 8.5GT/s
Memory Bandwidth 25.6GB/s	Memory Bandwidth 136.5GB/s

Power & Thermals

TDP 5W

TDP Shared

Video Output

Multi-Monitor 1

Multi-Monitor 3

Encoder

Encoder Model Hexagon 692

Encoder Model Xe Media Engine

Decoder

Decoder Model Hexagon 692

Decoder Model Xe Media Engine

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer Qualcomm	Manufacturer Intel
Chip Designer Qualcomm	Chip Designer Intel
Architecture Adreno 600	Architecture Battlemage
Family Adreno 600	Family Gen 13
Branding	Branding
Codename -	Codename Xe3 LPG
Chip Variant -	Chip Variant GT1
Market Segment Smartphone	Market Segment Laptop
Release Date Jan 20, 2020	Release Date Jan 5, 2026

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node N6	Fabrication Node Intel 3
Die Size -	Die Size 27mm²

Images

No images available

No images available

Used In

CPUs Snapdragon 720G Snapdragon 730 Snapdragon 730G Show 4 more	CPUs Core Ultra 5 336H
Laptops Galaxy Book Go(Mid 2021)	Laptops -
Smartphones Pixel 4a	Smartphones -
Tablets Galaxy Tab S6 Lite(SD 720G, Early 2022)	Tablets -

Competitors

QualcommAdreno 618 vs GPU QualcommAdreno 722 QualcommAdreno 618 vs GPU QualcommAdreno 840 QualcommAdreno 618 vs GPU IntelGraphics 2C 2300MHz Show 1 more

IntelGraphics 4C 2300MHz vs GPU IntelGraphics 4C 2500MHz IntelGraphics 4C 2300MHz vs GPU IntelGraphics 4C 2450MHz IntelGraphics 4C 2300MHz vs GPU AMDRadeon 860M 3000MHz Show 12 more