CPUs

Qualcomm Snapdragon 8 Gen 1 vs Intel Core i3-1115G4 Full Specs

8 Cores(1P+3M+4E)
8 Threads(1P+3M+4E)
3GHz
2 Cores
4 Threads
2.2GHz
TDP
5W
TDP
15W
Bandwidth
51.2GB/s
LPDDR5
Bandwidth
59.7GB/s
·
iGPU
iGPU
··
3.35 TFLOPSFP16
··
1.92 TFLOPSFP16
Socket
-
Socket

Snapdragon 8 Gen 1Snapdragon 8 Gen 151.2GB/s
x1
Core i3-1115G4Core i3-1115G459.7GB/s
x1.17

8 Cores
1P
3M
4E
2 Cores
2P
-
-
8 Threads
1P
3M
4E
4 Threads
4P
-
-

Base Clock
3GHz
Base Clock
2.2GHz
Boost Clock
-
Boost Clock
4.1GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
64KB M
32KB E
L1i
32KB P
-
-
L1d
64KB P
64KB M
32KB E
L1d
48KB P
-
-
L2
1MB P
512KB M
128KB E
L2
1.25MB P
-
-
L3
6MB
L3
6MB
SLC Cache
4MB
SLC Cache
-

Type
LPDDR5
Type
·
Max Memory
24GB
Max Memory
32GB
ECC
No
ECC
No
Channels
4
Channels
2
Bus Width
64-bit
Bus Width
128-bit
Speed
6400MT/s
Speed
3733MT/s
Bandwidth
51.2GB/s
Bandwidth
59.7GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
51.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
59.7GB/s

TDP
5W
TDP
15W
cTDP-down
-
cTDP-down
12W
cTDP-up
-
cTDP-up
28W
Max Operating Temp
-
Max Operating Temp
100°C Max

Bus Type
-
Bus Type
OPI
Bus Config
-
Bus Config
8 lanes
Bus Speed
-
Bus Speed
4GT/s
Bus Bandwidth
-
Bus Bandwidth
4GB/s

-
PCIe
PCIe 4.0 x4
7.9GB/sBandwidth

iGPU
iGPU
Shaders
1024
Shaders
384
Boost Clock
818MHz
Boost Clock
1.25GHz
··
3.35 TFLOPSFP16
··
1.92 TFLOPSFP16

NPU Model
Hexagon
NPU Model
GNA 2.0
Performance
52 TOPSINT4
Performance
-

Modem Model
X65
Modem Model
-
Cellular
5G mmWave
Cellular
-
Peak Down
Up to 10.0Gbps
Peak Down
-
Peak Up
Up to 3.0Gbps
Peak Up
-

Controller Model
-
Controller Model
500 Series UP3+
Codename
-
Codename
Tiger Lake
PCIe
-
PCIe
-

Manufacturer
Manufacturer
ISA
AArch64
ISA
x86-64
Architecture
KryoARMv9.0-A
Architecture
Family
Family
Branding
Snapdragon 8 Gen 1  branding
Branding
Core i3 2020 branding
Codename
-
Snapdragon 8 Gen 1Variant
Cortex-X2P-Core
Cortex-A710M-Core
Cortex-A510E-Core
Codename
Tiger Lake-UP3
Tiger Lake-4C-GT2Variant
Willow CoveP-Core
-
-
Market Segment
Smartphone
Market Segment
Laptop
Release Date
Oct 5, 2021
Release Date
Sep 2, 2020

Foundry
Samsung
Foundry
Intel
Other Foundries
-
Other Foundries
IntelPCH
Fabrication Node
4LPE
-
Fabrication Node
10nm SuperFin
14nmPCH
Die Size
129mm²
-
Die Size
123mm²
46mm²PCH
Transistor Count
-
Transistor Count
8 Billion
Transistor Density
-
Transistor Density
65 MTr/mm²

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