CPUs

Qualcomm Snapdragon 8 Gen 1 vs Intel Core i5-1235U Full Specs

8 Cores(1P+3M+4E)
8 Threads(1P+3M+4E)
3GHz
10 Cores(2P+8E)
12 Threads(4P+8E)
1.3GHz
TDP
5W
TDP
15W
Bandwidth
51.2GB/s
LPDDR5
Bandwidth
83.2GB/s
···
iGPU
iGPU
··
3.35 TFLOPSFP16
··
3.07 TFLOPSFP16
Socket
-
Socket

Snapdragon 8 Gen 1Snapdragon 8 Gen 11,311
x1
Core i5-1235UCore i5-1235U2,066
x1.58

8 Cores
1P
3M
4E
10 Cores
2P
-
8E
8 Threads
1P
3M
4E
12 Threads
4P
-
8E

Base Clock
3GHz
Base Clock
1.3GHz
Boost Clock
-
Boost Clock
4.4GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
64KB M
32KB E
L1i
32KB P
-
64KB E
L1d
64KB P
64KB M
32KB E
L1d
48KB P
-
32KB E
L2
1MB P
512KB M
128KB E
-
L2
1.25MB P
-
-
2MB E shared
L3
6MB
L3
12MB
SLC Cache
4MB
SLC Cache
-

Type
LPDDR5
Type
···
Max Memory
24GB
Max Memory
64GB
ECC
No
ECC
No
Channels
4
Channels
2
Bus Width
64-bit
Bus Width
128-bit
Speed
6400MT/s
Speed
5200MT/s
Bandwidth
51.2GB/s
Bandwidth
83.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
51.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
83.2GB/s

TDP
5W
TDP
15W
Peak Power
-
Peak Power
55W
Max Operating Temp
-
Max Operating Temp
100°C Max

Bus Type
-
Bus Type
OPI
Bus Config
-
Bus Config
8 lanes
Bus Speed
-
Bus Speed
4GT/s
Bus Bandwidth
-
Bus Bandwidth
4GB/s

-
PCIe
PCIe 4.0 x12
23.6GB/sBandwidth

iGPU
iGPU
Shaders
1024
Shaders
640
Boost Clock
818MHz
Boost Clock
1.2GHz
··
3.35 TFLOPSFP16
··
3.07 TFLOPSFP16

NPU Model
Hexagon
NPU Model
GNA 3.0
Performance
52 TOPSINT4
Performance
-

Modem Model
X65
Modem Model
-
Cellular
5G mmWave
Cellular
-
Peak Down
Up to 10.0Gbps
Peak Down
-
Peak Up
Up to 3.0Gbps
Peak Up
-

Controller Model
-
Controller Model
600 Series P+
Codename
-
Codename
Alder Lake
PCIe
-
PCIe
-

Manufacturer
Manufacturer
ISA
AArch64
ISA
x86-64
Architecture
KryoARMv9.0-A
Architecture
Family
Family
Branding
Snapdragon 8 Gen 1  branding
Branding
Core i5 2020 branding
Codename
-
Snapdragon 8 Gen 1Variant
Cortex-X2P-Core
Cortex-A710M-Core
Cortex-A510E-Core
Codename
Alder Lake-P
Alder Lake-2P-8EVariant
Golden CoveP-Core
-
GracemontE-Core
Market Segment
Smartphone
Market Segment
Laptop
Release Date
Oct 5, 2021
Release Date
Feb 23, 2022

Foundry
Samsung
Foundry
Intel
Other Foundries
-
Other Foundries
IntelPCH
Fabrication Node
4LPE
-
Fabrication Node
Intel 7
14nmPCH
Die Size
129mm²
-
Die Size
161mm²
54mm²PCH
Transistor Count
-
Transistor Count
11.9 Billion
Transistor Density
-
Transistor Density
74 MTr/mm²

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