CPUs

Qualcomm Snapdragon 8 Gen 1 vs Intel Pentium Gold 4425Y Full Specs

8 Cores(1P+3M+4E)
8 Threads(1P+3M+4E)
3GHz
2 Cores
4 Threads
1.7GHz
TDP
5W
TDP
6W
Bandwidth
51.2GB/s
LPDDR5
Bandwidth
29.9GB/s
·
iGPU
iGPU
··
3.35 TFLOPSFP16
··
326.4 GFLOPSFP16
Socket
-
Socket

Snapdragon 8 Gen 1Snapdragon 8 Gen 11,311
x3.08
Pentium Gold 4425YPentium Gold 4425Y425
x1

8 Cores
1P
3M
4E
2 Cores
2P
-
-
8 Threads
1P
3M
4E
4 Threads
4P
-
-

Base Clock
3GHz
Base Clock
1.7GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
64KB M
32KB E
L1i
32KB P
-
-
L1d
64KB P
64KB M
32KB E
L1d
32KB P
-
-
L2
1MB P
512KB M
128KB E
L2
256KB P
-
-
L3
6MB
L3
2MB
SLC Cache
4MB
SLC Cache
-

Type
LPDDR5
Type
·
Max Memory
24GB
Max Memory
16GB
ECC
No
ECC
No
Channels
4
Channels
2
Bus Width
64-bit
Bus Width
128-bit
Speed
6400MT/s
Speed
1866MT/s
Bandwidth
51.2GB/s
Bandwidth
29.9GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
51.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
29.9GB/s

TDP
5W
TDP
6W
cTDP-down
-
cTDP-down
5W
Max Operating Temp
-
Max Operating Temp
100°C Max

Bus Type
-
Bus Type
OPI
Bus Config
-
Bus Config
4 lanes
Bus Speed
-
Bus Speed
4GT/s
Bus Bandwidth
-
Bus Bandwidth
2GB/s

-
PCIe
PCIe 3.0 x10
9.8GB/sBandwidth

iGPU
iGPU
Shaders
1024
Shaders
192
Boost Clock
818MHz
Boost Clock
850MHz
··
3.35 TFLOPSFP16
··
326.4 GFLOPSFP16

NPU Model
Hexagon
NPU Model
-
Performance
52 TOPSINT4
Performance
-

Modem Model
X65
Modem Model
-
Cellular
5G mmWave
Cellular
-
Peak Down
Up to 10.0Gbps
Peak Down
-
Peak Up
Up to 3.0Gbps
Peak Up
-

Controller Model
-
Controller Model
300 Series Y+
Codename
-
Codename
Amber Lake
PCIe
-
PCIe
-

Manufacturer
Manufacturer
ISA
AArch64
ISA
x86-64
Architecture
KryoARMv9.0-A
Architecture
Family
Family
Branding
Snapdragon 8 Gen 1  branding
Branding
Pentium Gold 2017 branding
Codename
-
Snapdragon 8 Gen 1Variant
Cortex-X2P-Core
Cortex-A710M-Core
Cortex-A510E-Core
Codename
Amber Lake-Y
Amber Lake-2CVariant
-
-
-
Market Segment
Smartphone
Market Segment
Laptop
Release Date
Oct 5, 2021
Release Date
Jan 7, 2018

Foundry
Samsung
Foundry
Intel
Other Foundries
-
Other Foundries
IntelPCH
Fabrication Node
4LPE
-
Fabrication Node
14nm++
22nmPCH
Die Size
129mm²
-
Die Size
103mm²
52mm²PCH
Transistor Count
-
Transistor Count
1.8 Billion
Transistor Density
-
Transistor Density
17 MTr/mm²

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