Qualcomm Snapdragon 8 Gen 1 vs Intel Pentium Silver N6000 Full Specs

Summary

8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 3GHz	4 Cores 4 Threads 1.1GHz
TDP 5W	TDP 6W
Bandwidth 51.2GB/s LPDDR5	Bandwidth 46.9GB/s LPDDR4X·DDR4
iGPU Adreno 730	iGPU UHD 32EU 850MHz Gen 11
Peak·FP32·FP16 3.35 TFLOPSFP16	Peak·FP32·FP16 870.4 GFLOPSFP16
Socket -	Socket BGA 1338

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon 8 Gen 11,311

x2.52

Pentium Silver N6000520

x1

Show Top Score

Core Config

8 Cores 1P 3M 4E	4 Cores 4P - -
8 Threads 1P 3M 4E	4 Threads 4P - -

Clocks

Base Clock 3GHz	Base Clock 1.1GHz
Boost Clock -	Boost Clock 3.3GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P 64KB M 32KB E	L1i 32KB P - -
L1d 64KB P 64KB M 32KB E	L1d 32KB P - -
L2 1MB P 512KB M 128KB E -	L2 1.5MB P shared
L3 6MB	L3 4MB
SLC Cache 4MB	SLC Cache -

Memory

Type LPDDR5	Type LPDDR4X·DDR4
Max Memory 24GB	Max Memory 16GB
ECC No	ECC No
Channels 4	Channels 2
Bus Width 64-bit	Bus Width 128-bit
Speed 6400MT/s	Speed 2933MT/s
Bandwidth 51.2GB/s	Bandwidth 46.9GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 51.2GB/s	Bandwidth Calculator Channels Transfer Rate2933MT/s Calculated Bandwidth 46.9GB/s

Power & Thermals

TDP 5W	TDP 6W
cTDP-down -	cTDP-down 5W
Max Operating Temp -	Max Operating Temp 100°C Max

Expansion

-	PCIe PCIe 3.0 x8 7.9GB/sBandwidth

iGPU

iGPU Adreno 730	iGPU UHD 32EU 850MHz Gen 11
Shaders 1024	Shaders 256
Boost Clock 818MHz	Boost Clock 850MHz
Peak·FP32·FP16 3.35 TFLOPSFP16	Peak·FP32·FP16 870.4 GFLOPSFP16

NPU

NPU Model Hexagon	NPU Model -
Performance 52 TOPSINT4	Performance -

Cellular

Modem Model X65	Modem Model -
Cellular 5G mmWave	Cellular -
Peak Down Up to 10.0Gbps	Peak Down -
Peak Up Up to 3.0Gbps	Peak Up -

Chip

Manufacturer Qualcomm	Manufacturer Intel
ISA AArch64	ISA x86-64
Architecture KryoARMv9.0-A	Architecture Tremont
Family 8 Series	Family Pentium
Branding	Branding
Codename - Snapdragon 8 Gen 1Variant Cortex-X2P-Core Cortex-A710M-Core Cortex-A510E-Core	Codename Jasper Lake - - - -
Market Segment Smartphone	Market Segment Laptop
Release Date Oct 5, 2021	Release Date Jan 1, 2021

Fabrication

Foundry Samsung	Foundry Intel
Fabrication Node 4LPE	Fabrication Node 10nm+
Die Size 129mm²	Die Size -

Images

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Used In

Smartphones Galaxy S23 FEGalaxy S22Galaxy S22+ Show 2 more	Smartphones -
Tablets Galaxy Tab S8(SD 8G1, Early 2022)Galaxy Tab S8+(SD 8G1, Early 2022)Galaxy Tab S8 Ultra(SD 8G1, Early 2022)	Tablets HP Tablet 11-be0097nr(Pentium Silver, Mid 2022)

Competitors

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