CPUs

Qualcomm Snapdragon 800 (MSM8974AA v3) vs Qualcomm Snapdragon 808 Full Specs

4 Cores
4 Threads
2.26GHz
6 Cores(2P+4E)
6 Threads(2P+4E)
1.82GHz
TDP
5W
TDP
5W
Bandwidth
12.8GB/s
LPDDR3
Bandwidth
14.9GB/s
LPDDR3
iGPU
iGPU
··
230.4 GFLOPSFP16
··
307.2 GFLOPSFP16

4 Cores
4P
-
6 Cores
2P
4E
4 Threads
4P
-
6 Threads
2P
4E

Base Clock
2.26GHz
Base Clock
1.82GHz
Overclocking
Locked
Overclocking
Locked

L1i
16KB P
-
L1i
32KB P
16KB E
L1d
16KB P
-
L1d
32KB P
16KB E
L2
2MB P shared
-
L2
512KB P shared
1MB E shared

Type
LPDDR3
Type
LPDDR3
Max Memory
8GB
Max Memory
8GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
64-bit
Bus Width
64-bit
Speed
1600MT/s
Speed
1866MT/s
Bandwidth
12.8GB/s
Bandwidth
14.9GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
12.8GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
14.9GB/s

TDP
5W
TDP
5W

iGPU
iGPU
Shaders
128
Shaders
128
Boost Clock
450MHz
Boost Clock
600MHz
··
230.4 GFLOPSFP16
··
307.2 GFLOPSFP16

NPU Model
Hexagon QDSP6 V5
NPU Model
Hexagon V56
NPU Clock
600MHz
NPU Clock
800MHz

Modem Model
Gobi 5000
Modem Model
X10
Peak Down
Up to 150Mbps
Peak Down
Up to 450Mbps
Peak Up
Up to 50Mbps
Peak Up
Up to 50Mbps

Manufacturer
Manufacturer
ISA
AArch32
ISA
AArch64
Architecture
Krait 400ARMv7-A
Architecture
Family
Family
Branding
Snapdragon 8 Series  branding
Branding
Snapdragon 8 Series  branding
Codename
Cortex-A15P-Core
-
Codename
Cortex-A57P-Core
Cortex-A53E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Sep 9, 2014
Release Date
Sep 9, 2014

Foundry
TSMC
Foundry
Samsung
Fabrication Node
28nm HPM
Fabrication Node
28nm LP