CPUs

Qualcomm Snapdragon 808 vs Qualcomm Snapdragon 800 (MSM8974AA v3) Full Specs

6 Cores(2P+4E)
6 Threads(2P+4E)
1.82GHz
4 Cores
4 Threads
2.26GHz
TDP
5W
TDP
5W
Bandwidth
14.9GB/s
LPDDR3
Bandwidth
12.8GB/s
LPDDR3
iGPU
iGPU
··
307.2 GFLOPSFP16
··
230.4 GFLOPSFP16

6 Cores
2P
4E
4 Cores
4P
-
6 Threads
2P
4E
4 Threads
4P
-

Base Clock
1.82GHz
Base Clock
2.26GHz
Overclocking
Locked
Overclocking
Locked

L1i
32KB P
16KB E
L1i
16KB P
-
L1d
32KB P
16KB E
L1d
16KB P
-
L2
512KB P shared
1MB E shared
L2
2MB P shared
-

Type
LPDDR3
Type
LPDDR3
Max Memory
8GB
Max Memory
8GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
64-bit
Bus Width
64-bit
Speed
1866MT/s
Speed
1600MT/s
Bandwidth
14.9GB/s
Bandwidth
12.8GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
14.9GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
12.8GB/s

TDP
5W
TDP
5W

iGPU
iGPU
Shaders
128
Shaders
128
Boost Clock
600MHz
Boost Clock
450MHz
··
307.2 GFLOPSFP16
··
230.4 GFLOPSFP16

NPU Model
Hexagon V56
NPU Model
Hexagon QDSP6 V5
NPU Clock
800MHz
NPU Clock
600MHz

Modem Model
X10
Modem Model
Gobi 5000
Peak Down
Up to 450Mbps
Peak Down
Up to 150Mbps
Peak Up
Up to 50Mbps
Peak Up
Up to 50Mbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch32
Architecture
Architecture
Krait 400ARMv7-A
Family
Family
Branding
Snapdragon 8 Series  branding
Branding
Snapdragon 8 Series  branding
Codename
Cortex-A57P-Core
Cortex-A53E-Core
Codename
Cortex-A15P-Core
-
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Sep 9, 2014
Release Date
Sep 9, 2014

Foundry
Samsung
Foundry
TSMC
Fabrication Node
28nm LP
Fabrication Node
28nm HPM