CPUs

Qualcomm Snapdragon 808 vs Qualcomm Snapdragon 800 (MSM8274AC v3) Full Specs

6 Cores(2P+4E)
6 Threads(2P+4E)
1.82GHz
4 Cores
4 Threads
2.45GHz
TDP
5W
TDP
5W
Bandwidth
14.9GB/s
LPDDR3
Bandwidth
14.9GB/s
LPDDR3
iGPU
iGPU
··
307.2 GFLOPSFP16
··
295.9 GFLOPSFP16

6 Cores
2P
4E
4 Cores
4P
-
6 Threads
2P
4E
4 Threads
4P
-

Base Clock
1.82GHz
Base Clock
2.45GHz
Overclocking
Locked
Overclocking
Locked

L1i
32KB P
16KB E
L1i
16KB P
-
L1d
32KB P
16KB E
L1d
16KB P
-
L2
512KB P shared
1MB E shared
L2
2MB P shared
-

Type
LPDDR3
Type
LPDDR3
Max Memory
8GB
Max Memory
8GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
64-bit
Bus Width
64-bit
Speed
1866MT/s
Speed
1866MT/s
Bandwidth
14.9GB/s
Bandwidth
14.9GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
14.9GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
14.9GB/s

TDP
5W
TDP
5W

iGPU
iGPU
Shaders
128
Shaders
128
Boost Clock
600MHz
Boost Clock
578MHz
··
307.2 GFLOPSFP16
··
295.9 GFLOPSFP16

NPU Model
Hexagon V56
NPU Model
Hexagon QDSP6 V5
NPU Clock
800MHz
NPU Clock
600MHz

Modem Model
X10
Modem Model
Gobi 2000
Peak Down
Up to 450Mbps
Peak Down
Up to 7.2Mbps
Peak Up
Up to 50Mbps
Peak Up
Up to 5.8Mbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch32
Architecture
Architecture
Krait 400ARMv7-A
Family
Family
Branding
Snapdragon 8 Series  branding
Branding
Snapdragon 8 Series  branding
Codename
Cortex-A57P-Core
Cortex-A53E-Core
Codename
Cortex-A15P-Core
-
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Sep 9, 2014
Release Date
Jun 1, 2014

Foundry
Samsung
Foundry
TSMC
Fabrication Node
28nm LP
Fabrication Node
28nm HPM