Qualcomm Snapdragon 865+ vs Apple M2 (8C10G-FL) Full Specs

Summary

8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 3.1GHz	8 Cores(4P+4E) 8 Threads(4P+4E) 3.49GHz
TDP 5W	TDP 15W
Bandwidth 44GB/s LPDDR5·LPDDR4X	Bandwidth 102.4GB/s LPDDR5
iGPU Adreno 650+	iGPU 10-Core M2-FL
Peak·FP32·FP16 2.06 TFLOPSFP16	Peak·FP32·FP16 3.58 TFLOPSFP16

Core Config

8 Cores 1P 3M 4E	8 Cores 4P - 4E
8 Threads 1P 3M 4E	8 Threads 4P - 4E

Clocks

Base Clock 3.1GHz	Base Clock 3.49GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P 64KB M 32KB E	L1i 192KB P - 128KB E
L1d 64KB P 64KB M 32KB E	L1d 128KB P - 64KB E
L2 512KB P 256KB M 128KB E - -	L2 16MB P shared 4MB E shared
L3 4MB	L3 -
SLC Cache 3MB	SLC Cache 8MB

Memory

Type LPDDR5·LPDDR4X	Type LPDDR5
Max Memory 24GB	Max Memory 24GB
ECC No	ECC No
Channels 4	Channels 2
Bus Width 64-bit	Bus Width 128-bit
Speed 5500MT/s	Speed 6400MT/s
Bandwidth 44GB/s	Bandwidth 102.4GB/s
Bandwidth Calculator Channels Transfer Rate5500MT/s UC·Spec·OC 44GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s UC·Spec·OC 102.4GB/s

Power & Thermals

TDP 5W	TDP 15W
Max Operating Temp -	Max Operating Temp 100°C Max

Expansion

-	PCIe PCIe 4.0 x6 11.8GB/sBandwidth

iGPU

iGPU Adreno 650+	iGPU 10-Core M2-FL
Shaders 768	Shaders 1280
Boost Clock 670MHz	Boost Clock 1.4GHz
Peak·FP32·FP16 2.06 TFLOPSFP16	Peak·FP32·FP16 3.58 TFLOPSFP16

NPU

NPU Model Hexagon 698	NPU Model H14 Bia
NPU Cores -	NPU Cores 16
NPU Clock 576MHz	NPU Clock 2.1GHz
Performance 15 TOPS	Performance 15.8 TOPSFP16

Cellular

Modem Model X55	Modem Model -
Cellular 5G mmWave	Cellular -
Peak Down Up to 7.5Gbps	Peak Down -
Peak Up Up to 3.0Gbps	Peak Up -

Chip

Manufacturer Qualcomm	Manufacturer Apple
ISA AArch64	ISA AArch64
Architecture Kryo 585ARMv8.2-A	Architecture Apple Silicon 11ARMv8.5-A
Family 8 Series	Family M Series
Branding	Branding
Codename - - Cortex-A77P-Core Cortex-A77M-Core Cortex-A55E-Core	Codename Staten M2Variant AvalancheP-Core - BlizzardE-Core
Market Segment Smartphone	Market Segment Tablet
Release Date Aug 30, 2020	Release Date Jun 6, 2022

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N7P	Fabrication Node N5P
Die Size 84mm²	Die Size 153mm²
Transistor Count 10.3 Billion	Transistor Count 20.1 Billion
Transistor Density 123 MTr/mm²	Transistor Density 131 MTr/mm²

Images

Used In

Laptops -	Laptops MacBook Air 13(M2, Mid 2022)MacBook Air 15(M2, Mid 2023)
Tablets Galaxy Tab S7(SD 865+, Mid 2020)Galaxy Tab S7+(SD 865+, Mid 2020)	Tablets iPad Pro 11" Gen 4(M2, Early 2021)iPad Pro 12.9" Gen 6(M2, Early 2021)

Competitors

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