CPUs

Qualcomm Snapdragon 865+ vs Apple M5 (9C10G-FL) Full Specs

8 Cores(1P+3M+4E)
8 Threads(1P+3M+4E)
3.1GHz
9 Cores(3P+6E)
9 Threads(3P+6E)
4.46GHz
TDP
5W
TDP
15W
Bandwidth
44GB/s
·
Bandwidth
153.6GB/s
LPDDR5X
iGPU
iGPU
··
2.06 TFLOPSFP16
··
32.32 TOPSINT8 Tensor

8 Cores
1P
3M
4E
9 Cores
3P
-
6E
8 Threads
1P
3M
4E
9 Threads
3P
-
6E

Base Clock
3.1GHz
Base Clock
4.46GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
64KB M
32KB E
L1i
192KB P
-
128KB E
L1d
64KB P
64KB M
32KB E
L1d
128KB P
-
64KB E
L2
512KB P
256KB M
128KB E
-
-
L2
1MB P
-
-
16MB P shared
6MB E shared
L3
4MB
L3
-
SLC Cache
3MB
SLC Cache
8MB

Type
·
Type
LPDDR5X
Max Memory
24GB
Max Memory
32GB
ECC
No
ECC
No
Channels
4
Channels
2
Bus Width
64-bit
Bus Width
128-bit
Speed
5500MT/s
Speed
9600MT/s
Bandwidth
44GB/s
Bandwidth
153.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
44GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
153.6GB/s

TDP
5W
TDP
15W
Max Operating Temp
-
Max Operating Temp
100°C Max

-
PCIe
PCIe 4.0 x5
9.8GB/sBandwidth

iGPU
iGPU
Shaders
768
Shaders
1280
Boost Clock
670MHz
Boost Clock
1.58GHz
··
2.06 TFLOPSFP16
··
32.32 TOPSINT8 Tensor

NPU Model
Hexagon 698
NPU Model
H17 Theia
NPU Cores
-
NPU Cores
16
NPU Clock
576MHz
NPU Clock
2.45GHz
Performance
15 TOPS
Performance
38 TOPSINT8

Modem Model
X55
Modem Model
-
Cellular
5G mmWave
Cellular
-
Peak Down
Up to 7.5Gbps
Peak Down
-
Peak Up
Up to 3.0Gbps
Peak Up
-

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Kryo 585ARMv8.2-A
Architecture
Family
Family
Branding
Snapdragon 5G  branding
Branding
M5  branding
Codename
-
-
Cortex-A77P-Core
Cortex-A77M-Core
Cortex-A55E-Core
Codename
Hidra
M5Variant
AS15PP-Core
-
AS15EE-Core
Market Segment
Smartphone
Market Segment
Tablet
Release Date
Aug 30, 2020
Release Date
Oct 15, 2025

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N7P
Fabrication Node
N3P
Die Size
84mm²
Die Size
-
Transistor Count
10.3 Billion
Transistor Count
-
Transistor Density
123 MTr/mm²
Transistor Density
-