Qualcomm Snapdragon 865+ vs Intel Core m3-6Y30 Full Specs

Summary

8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 3.1GHz	2 Cores 4 Threads 900MHz
TDP 5W	TDP 4.5W
Bandwidth 44GB/s LPDDR5·LPDDR4X	Bandwidth 29.9GB/s LPDDR3·DDR3L
iGPU Adreno 650+	iGPU HD 515 850MHz
Peak·FP32·FP16 2.06 TFLOPSFP16	Peak·FP32·FP16 326.4 GFLOPSFP32
Socket -	Socket BGA 1515

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon 865+1,134

x1.60

Core m3-6Y30710

x1

Show Top Score

Core Config

8 Cores 1P 3M 4E	2 Cores 2P - -
8 Threads 1P 3M 4E	4 Threads 4P - -

Clocks

Base Clock 3.1GHz	Base Clock 900MHz
Boost Clock -	Boost Clock 2.2GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P 64KB M 32KB E	L1i 32KB P - -
L1d 64KB P 64KB M 32KB E	L1d 32KB P - -
L2 512KB P 256KB M 128KB E	L2 256KB P - -
L3 4MB	L3 4MB
SLC Cache 3MB	SLC Cache -

Memory

Type LPDDR5·LPDDR4X	Type LPDDR3·DDR3L
Max Memory 24GB	Max Memory 16GB
ECC No	ECC No
Channels 4	Channels 2
Bus Width 64-bit	Bus Width 128-bit
Speed 5500MT/s	Speed 1866MT/s
Bandwidth 44GB/s	Bandwidth 29.9GB/s
Bandwidth Calculator Channels Transfer Rate5500MT/s Calculated Bandwidth 44GB/s	Bandwidth Calculator Channels Transfer Rate1866MT/s Calculated Bandwidth 29.9GB/s

Power & Thermals

TDP 5W	TDP 4.5W
cTDP-down -	cTDP-down 4W
Max Operating Temp -	Max Operating Temp 100°C Max
Included Cooler -	Included Cooler 0

Chipset Bus

Bus Type -	Bus Type OPI
Bus Config -	Bus Config 4 lanes
Bus Speed -	Bus Speed 4GT/s
Bus Bandwidth -	Bus Bandwidth 2GB/s

Expansion

-	PCIe PCIe 3.0 x10 9.8GB/sBandwidth

iGPU

iGPU Adreno 650+	iGPU HD 515 850MHz
Shaders 768	Shaders 192
Boost Clock 670MHz	Boost Clock 850MHz
Peak·FP32·FP16 2.06 TFLOPSFP16	Peak·FP32·FP16 326.4 GFLOPSFP32

NPU

NPU Model Hexagon 698	NPU Model -
NPU Clock 576MHz	NPU Clock -
Performance 15 TOPS	Performance -

Cellular

Modem Model X55	Modem Model -
Cellular 5G mmWave	Cellular -
Peak Down Up to 7.5Gbps	Peak Down -
Peak Up Up to 3.0Gbps	Peak Up -

Controller

Controller Model -	Controller Model 100 Series Y+
Codename -	Codename Skylake
PCIe -	PCIe -

Chip

Manufacturer Qualcomm	Manufacturer Intel
ISA AArch64	ISA x86-64
Architecture Kryo 585ARMv8.2-A	Architecture Skylake
Family 8 Series	Family Core 6th Gen
Branding	Branding
Codename - - Cortex-A77P-Core Cortex-A77M-Core Cortex-A55E-Core	Codename Skylake-H Skylake-2C-GT2Variant - - -
Market Segment Smartphone	Market Segment Laptop
Release Date Aug 30, 2020	Release Date Sep 1, 2015

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries -	Other Foundries IntelPCH
Fabrication Node N7P -	Fabrication Node 14nm 22nmPCH
Die Size 84mm² -	Die Size 102mm² 50mm²PCH
Transistor Count 10.3 Billion	Transistor Count 1.8 Billion
Transistor Density 123 MTr/mm²	Transistor Density 17 MTr/mm²

Images

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Used In

Tablets Galaxy Tab S7(SD 865+, Mid 2020)Galaxy Tab S7+(SD 865+, Mid 2020)

Tablets Surface Pro 4(Intel 6th Gen, Late 2015)

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