Qualcomm Snapdragon 865+ vs Qualcomm Snapdragon 8 Gen 1 Full Specs

Summary

8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 3.1GHz	8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 3GHz
TDP 5W	TDP 5W
Bandwidth 44GB/s LPDDR5·LPDDR4X	Bandwidth 51.2GB/s LPDDR5
iGPU Adreno 650+	iGPU Adreno 730
Peak·FP32·FP16 2.06 TFLOPSFP16	Peak·FP32·FP16 3.35 TFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon 865+1,134

x1

Snapdragon 8 Gen 11,311

x1.16

Show Top Score

Core Config

8 Cores 1P 3M 4E	8 Cores 1P 3M 4E
8 Threads 1P 3M 4E	8 Threads 1P 3M 4E

Clocks

Base Clock 3.1GHz	Base Clock 3GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P 64KB M 32KB E	L1i 64KB P 64KB M 32KB E
L1d 64KB P 64KB M 32KB E	L1d 64KB P 64KB M 32KB E
L2 512KB P 256KB M 128KB E	L2 1MB P 512KB M 128KB E
L3 4MB	L3 6MB
SLC Cache 3MB	SLC Cache 4MB

Memory

Type LPDDR5·LPDDR4X	Type LPDDR5
Max Memory 24GB	Max Memory 24GB
ECC No	ECC No
Channels 4	Channels 4
Bus Width 64-bit	Bus Width 64-bit
Speed 5500MT/s	Speed 6400MT/s
Bandwidth 44GB/s	Bandwidth 51.2GB/s
Bandwidth Calculator Channels Transfer Rate5500MT/s Calculated Bandwidth 44GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 51.2GB/s

Power & Thermals

TDP 5W

TDP 5W

iGPU

iGPU Adreno 650+	iGPU Adreno 730
Shaders 768	Shaders 1024
Boost Clock 670MHz	Boost Clock 818MHz
Peak·FP32·FP16 2.06 TFLOPSFP16	Peak·FP32·FP16 3.35 TFLOPSFP16

NPU

NPU Model Hexagon 698	NPU Model Hexagon
NPU Clock 576MHz	NPU Clock -
Performance 15 TOPS	Performance 52 TOPSINT4

Cellular

Modem Model X55	Modem Model X65
Cellular 5G mmWave	Cellular 5G mmWave
Peak Down Up to 7.5Gbps	Peak Down Up to 10.0Gbps
Peak Up Up to 3.0Gbps	Peak Up Up to 3.0Gbps

Chip

Manufacturer Qualcomm	Manufacturer Qualcomm
ISA AArch64	ISA AArch64
Architecture Kryo 585ARMv8.2-A	Architecture KryoARMv9.0-A
Family 8 Series	Family 8 Series
Branding	Branding
Codename - Cortex-A77P-Core Cortex-A77M-Core Cortex-A55E-Core	Codename Snapdragon 8 Gen 1Variant Cortex-X2P-Core Cortex-A710M-Core Cortex-A510E-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date Aug 30, 2020	Release Date Oct 5, 2021

Fabrication

Foundry TSMC	Foundry Samsung
Fabrication Node N7P	Fabrication Node 4LPE
Die Size 84mm²	Die Size 129mm²
Transistor Count 10.3 Billion	Transistor Count -
Transistor Density 123 MTr/mm²	Transistor Density -

Images

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No images available

Used In

Smartphones -	Smartphones Galaxy S23 FEGalaxy S22Galaxy S22+ Show 2 more
Tablets Galaxy Tab S7(SD 865+, Mid 2020)Galaxy Tab S7+(SD 865+, Mid 2020)	Tablets Galaxy Tab S8(SD 8G1, Early 2022)Galaxy Tab S8+(SD 8G1, Early 2022)Galaxy Tab S8 Ultra(SD 8G1, Early 2022)

Competitors

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