Qualcomm Snapdragon X Plus (X1P-64-100) vs Apple M5 (10C8G-FL) Full Specs

Summary

10 Cores 10 Threads 3.4GHz	10 Cores(4P+6E) 10 Threads(4P+6E) 4.46GHz
TDP 23W	TDP 15W
Bandwidth 135.2GB/s LPDDR5X	Bandwidth 153.6GB/s LPDDR5X
iGPU Adreno X1 3.8T	iGPU 8-Core M5-FL
Peak·FP32·FP16 7.68 TFLOPSFP16	Peak·FP32·FP16 6.46 TFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon X Plus (X1P-64-100)2,349

x1

M5 (10C8G-FL)4,175

x1.78

Show Top Score

Core Config

10 Cores 10P -	10 Cores 4P 6E
10 Threads 10P -	10 Threads 4P 6E

Clocks

Base Clock 3.4GHz	Base Clock 4.46GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P -	L1i 192KB P 128KB E
L1d 96KB P -	L1d 128KB P 64KB E
L2 36MB P shared -	L2 1MB P 16MB P shared 6MB E shared
SLC Cache 6MB	SLC Cache 8MB

Memory

Type LPDDR5X	Type LPDDR5X
Max Memory 64GB	Max Memory 32GB
ECC No	ECC No
Channels 8	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 8448MT/s	Speed 9600MT/s
Bandwidth 135.2GB/s	Bandwidth 153.6GB/s
Bandwidth Calculator Channels Transfer Rate8448MT/s Calculated Bandwidth 135.2GB/s	Bandwidth Calculator Channels Transfer Rate9600MT/s Calculated Bandwidth 153.6GB/s

Power & Thermals

TDP 23W	TDP 15W
Max Operating Temp -	Max Operating Temp 100°C Max

Expansion

PCIe PCIe 4.0 x12 23.6GB/sBandwidth	PCIe PCIe 4.0 x5 9.8GB/sBandwidth
PCIe Secondary PCIe 3.0 x4 3.9GB/sBandwidth	-

iGPU

iGPU Adreno X1 3.8T	iGPU 8-Core M5-FL
Shaders 1536	Shaders 1024
Boost Clock 1.25GHz	Boost Clock 1.58GHz
Peak·FP32·FP16 7.68 TFLOPSFP16	Peak·FP32·FP16 6.46 TFLOPSFP16

NPU

NPU Model Hexagon	NPU Model H17 Theia
NPU Cores -	NPU Cores 16
NPU Clock -	NPU Clock 2.45GHz
Performance 45 TOPSINT8	Performance 38 TOPSINT8

Chip

Manufacturer Qualcomm	Manufacturer Apple
ISA AArch64	ISA AArch64
Architecture OryonARMv8.7-A	Architecture Apple Silicon 15ARMv9.2-A
Family X Series	Family M Series
Branding	Branding
Codename Hamoa Snapdragon X EliteVariant PhoenixP-Core -	Codename Hidra M5Variant AS15PP-Core AS15EE-Core
Market Segment Laptop	Market Segment Tablet
Release Date Apr 24, 2024	Release Date Mar 3, 2026

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N4P	Fabrication Node N3P
Die Size 170mm²	Die Size -

Images

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Used In

Laptops XPS 13(9345, Mid 2024)Inspiron 14(5441, Late 2024)Inspiron 14 Plus(7441, Late 2024) Show 2 more	Laptops MacBook Air 13(M5, Early 2026)
Tablets Surface Pro 11(X Elite, Mid 2024)	Tablets -

Competitors

QualcommSnapdragon X Plus (X1P-64-100) vs CPU QualcommSnapdragon X2 Elite (X2E-80-100) QualcommSnapdragon X Plus (X1P-64-100) vs CPU AMDRyzen AI 7 PRO 350 QualcommSnapdragon X Plus (X1P-64-100) vs CPU AMDRyzen 7 260 Show 12 more

AppleM5 (10C8G-FL) vs CPU AppleM4 (8C9G-FL) AppleM5 (10C8G-FL) vs CPU AppleM4 (10C8G-FL) AppleM5 (10C8G-FL) vs CPU AppleM3 (8C9G-FL) Show 12 more