Qualcomm Snapdragon X Plus (X1P-64-100) vs Intel Core i3-1315U Full Specs

Summary

10 Cores 10 Threads 3.4GHz	6 Cores(2P+4E) 8 Threads(4P+4E) 1.2GHz
TDP 23W	TDP 15W
Bandwidth 135.2GB/s LPDDR5X	Bandwidth 102.4GB/s LPDDR5X·DDR5·LPDDR4X·DDR4
iGPU Adreno X1 3.8T	iGPU UHD 64EU 1250MHz Gen 12
Peak·FP32·FP16 7.68 TFLOPSFP16	Peak·FP32·FP16 2.56 TFLOPSFP16
Socket -	Socket BGA 1744

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi E-Core Boost Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon X Plus (X1P-64-100)2,349

x1.15

Core i3-1315U2,050

x1

Show Top Score

Core Config

10 Cores 10P -	6 Cores 2P 4E
10 Threads 10P -	8 Threads 4P 4E

Clocks

Base Clock 3.4GHz	Base Clock 1.2GHz
Boost Clock -	Boost Clock 4.5GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P -	L1i 32KB P 64KB E
L1d 96KB P -	L1d 48KB P 32KB E
L2 36MB P shared -	L2 1.25MB P - 2MB E shared
L3 -	L3 10MB
SLC Cache 6MB	SLC Cache -

Memory

Type LPDDR5X	Type LPDDR5X·DDR5·LPDDR4X·DDR4
Max Memory 64GB	Max Memory 96GB
ECC No	ECC No
Channels 8	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 8448MT/s	Speed 6400MT/s
Bandwidth 135.2GB/s	Bandwidth 102.4GB/s
Bandwidth Calculator Channels Transfer Rate8448MT/s Calculated Bandwidth 135.2GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 102.4GB/s

Power & Thermals

TDP 23W	TDP 15W
Peak Power -	Peak Power 55W
Max Operating Temp -	Max Operating Temp 100°C Max

Chipset Bus

Bus Type -	Bus Type OPI
Bus Config -	Bus Config 8 lanes
Bus Speed -	Bus Speed 4GT/s
Bus Bandwidth -	Bus Bandwidth 4GB/s

Expansion

PCIe PCIe 4.0 x12 23.6GB/sBandwidth	PCIe PCIe 4.0 x16 31.5GB/sBandwidth
PCIe Secondary PCIe 3.0 x4 3.9GB/sBandwidth	PCIe Secondary PCIe 3.0 x4 3.9GB/sBandwidth

iGPU

iGPU Adreno X1 3.8T	iGPU UHD 64EU 1250MHz Gen 12
Shaders 1536	Shaders 512
Boost Clock 1.25GHz	Boost Clock 1.25GHz
Peak·FP32·FP16 7.68 TFLOPSFP16	Peak·FP32·FP16 2.56 TFLOPSFP16

NPU

NPU Model Hexagon	NPU Model GNA 3.0
Performance 45 TOPSINT8	Performance -

Controller

Controller Model -	Controller Model 700 Series P+
Codename -	Codename Raptor Lake
PCIe -	PCIe -

Chip

Manufacturer Qualcomm	Manufacturer Intel
ISA AArch64	ISA x86-64
Architecture OryonARMv8.7-A	Architecture Raptor Lake
Family X Series	Family Core 13th Gen
Branding	Branding
Codename Hamoa Snapdragon X EliteVariant PhoenixP-Core -	Codename Raptor Lake-U Raptor Lake-2P-8EVariant Golden CoveP-Core GracemontE-Core
Market Segment Laptop	Market Segment Laptop
Release Date Apr 24, 2024	Release Date Jan 1, 2023

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries -	Other Foundries IntelPCH
Fabrication Node N4P -	Fabrication Node Intel 7 14nmPCH
Die Size 170mm² -	Die Size 161mm² 54mm²PCH
Transistor Count -	Transistor Count 11.9 Billion
Transistor Density -	Transistor Density 74 MTr/mm²

Images

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Used In

Laptops XPS 13(9345, Mid 2024)Inspiron 14(5441, Late 2024)Inspiron 14 Plus(7441, Late 2024) Show 2 more	Laptops Inspiron 14(5430, Early 2023)Inspiron 14 2-in-1(7430, Early 2023)Inspiron 16(5630, Early 2023) Show 1 more
Tablets Surface Pro 11(X Elite, Mid 2024)	Tablets -

Competitors

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IntelCore i3-1315U vs CPU AMDRyzen AI 5 PRO 340 IntelCore i3-1315U vs CPU AMDRyzen AI 5 340 IntelCore i3-1315U vs CPU AMDRyzen 5 220 Show 12 more