Qualcomm Snapdragon X Plus (X1P-64-100) vs Intel Core i5-13420H Full Specs

Summary

10 Cores 10 Threads 3.4GHz	8 Cores(4P+4E) 12 Threads(8P+4E) 2.1GHz
TDP 23W	TDP 45W
Bandwidth 135.2GB/s LPDDR5X	Bandwidth 102.4GB/s LPDDR5X·DDR5·LPDDR4X·DDR4
iGPU Adreno X1 3.8T	iGPU UHD 48EU 1400MHz Gen 12
Peak·FP32·FP16 7.68 TFLOPSFP16	Peak·FP32·FP16 2 TFLOPSFP16
Socket -	Socket BGA 1744

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi E-Core Boost Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon X Plus (X1P-64-100)2,349

x1.02

Core i5-13420H2,292

x1

Show Top Score

Core Config

10 Cores 10P -	8 Cores 4P 4E
10 Threads 10P -	12 Threads 8P 4E

Clocks

Base Clock 3.4GHz	Base Clock 2.1GHz
Boost Clock -	Boost Clock 4.6GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P -	L1i 32KB P 64KB E
L1d 96KB P -	L1d 48KB P 32KB E
L2 36MB P shared -	L2 1.25MB P - 2MB E shared
L3 -	L3 12MB
SLC Cache 6MB	SLC Cache -

Memory

Type LPDDR5X	Type LPDDR5X·DDR5·LPDDR4X·DDR4
Max Memory 64GB	Max Memory 64GB
ECC No	ECC No
Channels 8	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 8448MT/s	Speed 6400MT/s
Bandwidth 135.2GB/s	Bandwidth 102.4GB/s
Bandwidth Calculator Channels Transfer Rate8448MT/s Calculated Bandwidth 135.2GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 102.4GB/s

Power & Thermals

TDP 23W	TDP 45W
Peak Power -	Peak Power 95W
Max Operating Temp -	Max Operating Temp 100°C Max

Chipset Bus

Bus Type -	Bus Type DMI
Bus Config -	Bus Config 8 lanes
Bus Speed -	Bus Speed 16GT/s
Bus Bandwidth -	Bus Bandwidth 16GB/s

Expansion

PCIe PCIe 4.0 x12 23.6GB/sBandwidth	PCIe PCIe 5.0 x16 63GB/sBandwidth
PCIe Secondary PCIe 3.0 x4 3.9GB/sBandwidth	PCIe Secondary PCIe 4.0 x8 15.8GB/sBandwidth

iGPU

iGPU Adreno X1 3.8T	iGPU UHD 48EU 1400MHz Gen 12
Shaders 1536	Shaders 384
Boost Clock 1.25GHz	Boost Clock 1.3GHz
Peak·FP32·FP16 7.68 TFLOPSFP16	Peak·FP32·FP16 2 TFLOPSFP16

NPU

NPU Model Hexagon	NPU Model GNA 3.0
Performance 45 TOPSINT8	Performance -

Chip

Manufacturer Qualcomm	Manufacturer Intel
ISA AArch64	ISA x86-64
Architecture OryonARMv8.7-A	Architecture Raptor Lake
Family X Series	Family Core 13th Gen
Branding	Branding
Codename Hamoa Snapdragon X EliteVariant PhoenixP-Core -	Codename Raptor Lake-H Raptor Lake-6P-8EVariant Golden CoveP-Core GracemontE-Core
Market Segment Laptop	Market Segment Laptop
Release Date Apr 24, 2024	Release Date Jan 1, 2023

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node N4P	Fabrication Node Intel 7
Die Size 170mm²	Die Size 208mm²
Transistor Count -	Transistor Count 15.2 Billion
Transistor Density -	Transistor Density 73 MTr/mm²

Images

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Used In

Laptops XPS 13(9345, Mid 2024)Inspiron 14(5441, Late 2024)Inspiron 14 Plus(7441, Late 2024) Show 2 more	Laptops Alienware X14(R2, Early 2023)Inspiron 14 Plus(7430, Early 2023)Inspiron 16 Plus(7630, Early 2023)
Tablets Surface Pro 11(X Elite, Mid 2024)	Tablets -

Competitors

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IntelCore i5-13420H vs CPU IntelCore Ultra 5 235UA IntelCore i5-13420H vs CPU AMDRyzen AI 7 PRO 350 IntelCore i5-13420H vs CPU AMDRyzen AI Max 385 Show 12 more