Qualcomm Snapdragon X Plus (X1P-64-100) vs Intel Core Ultra 5 225U Full Specs

Summary

10 Cores 10 Threads 3.4GHz	12 Cores(2P+8M+2E) 14 Threads(4P+8M+2E) 1.5GHz
TDP 23W	TDP 15W
Bandwidth 135.2GB/s LPDDR5X	Bandwidth 134.4GB/s LPDDR5X·DDR5
iGPU Adreno X1 3.8T	iGPU Graphics 4C 2000MHz
Peak·FP32·FP16 7.68 TFLOPSFP16	Peak·FP32·FP16 4.1 TFLOPSFP16
Socket -	Socket BGA 2049

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi E-Core Boost Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon X Plus (X1P-64-100)2,349

x1

Core Ultra 5 225U-

-

Show Top Score

Core Config

10 Cores 10P - -	12 Cores 2P 8M 2E
10 Threads 10P - -	14 Threads 4P 8M 2E

Clocks

Base Clock 3.4GHz	Base Clock 1.5GHz
Boost Clock -	Boost Clock 4.8GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P - -	L1i 64KB P 64KB M 64KB E
L1d 96KB P - -	L1d 48KB P 32KB M 32KB E
L2 36MB P shared - -	L2 3MB P - 8MB M shared 8MB E shared
L3 -	L3 12MB
SLC Cache 6MB	SLC Cache -

Memory

Type LPDDR5X	Type LPDDR5X·DDR5
Max Memory 64GB	Max Memory 96GB
ECC No	ECC No
Channels 8	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 8448MT/s	Speed 8400MT/s
Bandwidth 135.2GB/s	Bandwidth 134.4GB/s
Bandwidth Calculator Channels Transfer Rate8448MT/s Calculated Bandwidth 135.2GB/s	Bandwidth Calculator Channels Transfer Rate8400MT/s Calculated Bandwidth 134.4GB/s

Power & Thermals

TDP 23W	TDP 15W
cTDP-down -	cTDP-down 12W
Peak Power -	Peak Power 57W
Max Operating Temp -	Max Operating Temp 110°C Max

Expansion

PCIe PCIe 4.0 x12 23.6GB/sBandwidth	PCIe PCIe 4.0 x20 39.4GB/sBandwidth
PCIe Secondary PCIe 3.0 x4 3.9GB/sBandwidth	-

iGPU

iGPU Adreno X1 3.8T	iGPU Graphics 4C 2000MHz
Shaders 1536	Shaders 512
Boost Clock 1.25GHz	Boost Clock 2GHz
Peak·FP32·FP16 7.68 TFLOPSFP16	Peak·FP32·FP16 4.1 TFLOPSFP16

NPU

NPU Model Hexagon	NPU Model AI Boost 3
NPU Cores -	NPU Cores 2
Performance 45 TOPSINT8	Performance 13 TOPSINT8

Chip

Manufacturer Qualcomm	Manufacturer Intel
ISA AArch64	ISA x86-64
Architecture OryonARMv8.7-A	Architecture Arrow Lake
Family X Series	Family Core Ultra Series 2
Branding	Branding
Codename Hamoa Snapdragon X EliteVariant PhoenixP-Core - -	Codename Arrow Lake-U Arrow Lake-U-2P-8EVariant Redwood CoveP-Core CrestmontM-Core CrestmontE-Core
Market Segment Laptop	Market Segment Laptop
Release Date Apr 24, 2024	Release Date Jan 6, 2025

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries -	Other Foundries TSMCiGPU TSMCIO TSMCSoC
Fabrication Node N4P - - -	Fabrication Node Intel 3 N5iGPU N6IO N6SoC
Die Size 170mm² - - -	Die Size - 23mm²iGPU 10mm²IO 100mm²SoC

Images

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Used In

Laptops XPS 13(9345, Mid 2024)Inspiron 14(5441, Late 2024)Inspiron 14 Plus(7441, Late 2024) Show 2 more	Laptops -
Tablets Surface Pro 11(X Elite, Mid 2024)	Tablets -

Competitors

QualcommSnapdragon X Plus (X1P-64-100) vs CPU QualcommSnapdragon X2 Elite (X2E-80-100) QualcommSnapdragon X Plus (X1P-64-100) vs CPU AMDRyzen 7 260 QualcommSnapdragon X Plus (X1P-64-100) vs CPU IntelCore Ultra 5 235U Show 12 more

IntelCore Ultra 5 225U vs CPU IntelCore Ultra 5 235U IntelCore Ultra 5 225U vs CPU IntelCore Ultra 7 265U IntelCore Ultra 5 225U vs CPU IntelCore Ultra 5 235H Show 12 more