ATI Radeon HD 3850 X2 vs ATI Radeon HD 4650 Full Specs
640 Shaders 668MHz | 320 Shaders 650MHz |
1048MB GDDR3106GB/s | 524MB GDDR316GB/s |
·· 855 GFLOPS | ·· 416 GFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 140W | TDP 48W |
Power Connectors 1x 8-Pin 1x 6-Pin | Power Connectors - |
Clock Speed ·· | Clock Speed ··· |
Peak OPS 855 GFLOPSFP32 | Peak OPS 416 GFLOPSFP32 |
FP32 855 GFLOPS | FP32 416 GFLOPS |
FP64 171 GFLOPS | - |
Pixel Rate 10.7 GPixel/s | Pixel Rate 5.2 GPixel/s |
Texture Rate 10.7 GTexel/s | Texture Rate 20.8 GTexel/s |
Shaders 640 Shaders | Shaders 320 Shaders |
TMUs 32 TMUs | TMUs 32 TMUs |
ROPs 32 ROPs | ROPs 8 ROPs |
CUs 8 CUs | CUs 4 CUs |
Base Clock - | Base Clock 600MHz |
Boost Clock 668MHz | Boost Clock 650MHz |
L2 Cache 256KB shared | L2 Cache 128KB shared |
1048MB GDDR3 | 524MB GDDR3 |
Memory Bus 256-bit | Memory Bus 128-bit |
Memory Speed 1.7GT/s | Memory Speed 1GT/s |
Memory Bandwidth 106GB/s | Memory Bandwidth 16GB/s |
TDP 140W | TDP 48W |
Multi-Monitor 2 | Multi-Monitor 2 |
2x DVI-I Dual-Link | 2x DVI-I Dual-Link |
1x S-Video | 1x S-Video |
Decoder Model UVD 1.0 | Decoder Model UVD 2.2 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 1-Slots |
Cooling Open-Air 1x Fan | Cooling Blower 1x Fan |
Power Connectors 1x 8-Pin, 1x 6-Pin | Power Connectors - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Boom | Codename Mario |
Chip Variant RV670 Pro | Chip Variant RV730 Pro |
Market Segment Desktop | Market Segment Desktop |
Release Date Apr 4, 2008 | Release Date Sep 10, 2008 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 55nm | Fabrication Node 55nm |
Die Size 192mm² | Die Size 146mm² |
Transistor Count 666 Million | Transistor Count 514 Million |
Transistor Density 3.47 MTr/mm² | Transistor Density 3.52 MTr/mm² |
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